Turn-key 4 layers PCB Assembly Board Boleng bo phahameng ba FR4 Multilayer PCBA
Lintlha tsa tlhahiso
| Mohlala No. | PCB-A3 |
| Sephutheloana sa lipalangoang | Ho paka ka Vacuum |
| Setifikeiti | UL,ISO9001&ISO14001,RoHS |
| Litlhaloso | Sehlopha sa 2 sa IPC |
| Bonyane Sebaka/Mola | 0.075mm/3mil |
| Tšimoloho | E entsoe chaena |
| Bokhoni ba Tlhahiso | 720,000 M2/Selemo |
| Kopo | Electronics ea bareki |
Tlhaloso ea Sehlahisoa
Selelekela sa Merero ea PCBA
Khamphani ea ABIS CIRCUITS e fana ka lits'ebeletso, eseng lihlahisoa feela.Re fana ka tharollo, eseng feela thepa.
Ho tloha tlhahiso ea PCB, likarolo tse rekang ho ea ho likarolo lia bokana.E kenyeletsa:
PCB Tloaelo
Setšoantšo sa PCB / moralo ho latela setšoantšo sa hau sa moralo
Tlhahiso ea PCB
Ho fumana likarolo
Khokahano ea PCB
PCBA 100% teko
Melemo ea Rōna
Lisebelisoa tsa boemo bo holimo-mechini e potlakileng ea ho khetha le ho beha sebaka e ka sebetsanang le likarolo tse ka bang 25,000 tsa SMD ka hora.
Bokhoni bo phahameng ba phepelo ea 60K Sqm khoeli le khoeli-E fana ka molumo o tlase le tlhahiso ea PCB e batloang, le lihlahisoa tse kholo.
Sehlopha sa boenjiniere ba litsebi-40 baenjiniere le ntlo ea bona ea lisebelisoa, e matla ho OEM.E fana ka likhetho tse peli tse bonolo: Tsebo ea Tloaelo le e Tloaelehileng ka botebo ka IPC Class II le III Standards
Re fana ka ts'ebeletso e felletseng ea EMS ho bareki ba batlang hore re bokelle PCB ho PCBA, ho kenyeletsoa prototypes, morero oa NPI, molumo o monyane le o mahareng.Re boetse re khona ho fumana likarolo tsohle tsa morero oa hau oa kopano oa PCB.Baenjineri ba rona le sehlopha sa mehloli ba na le boiphihlelo bo bongata indastering ea phepelo le indastering ea EMS, ba nang le tsebo e tebileng kopanong ea SMT e lumellang ho rarolla mathata ohle a tlhahiso.Litšebeletso tsa rona li boloka chelete e ngata, lia tenyetseha ebile lia tšepahala.Re khotsofetse bareki ho pholletsa le liindasteri tse ngata ho kenyeletsa bongaka, indasteri, likoloi le lisebelisoa tsa motlakase tsa bareki.
Matla a PCBA
| Bokhoni |
|
| SMT/PTH e nang le lehlakore le le leng le habeli | Ee |
| Likarolo tse kholo ka mahlakoreng ka bobeli, BGA ka mahlakore ka bobeli | Ee |
| Li-Chips tse nyane ka ho fetisisa | 0201 |
| Min BGA le Micro BGA palo le lipalo tsa bolo | 0.008 in. (0.2mm) palo, palo ea bolo e kholo ho feta 1000 |
| Likarolo tsa Min Leaded pitch | 0.008 in. (0.2 mm) |
| Kopano ea boholo ba likarolo tsa Max ka mochini | 2.2 in. x 2.2 in. x 0.6 in. |
| Kopano holim'a thaba lihokelo | Ee |
| Likarolo tse sa tloaelehang: | E, Kopano ka matsoho |
| LED | |
| Li-network tsa resistor le capacitor | |
| Li-capacitors tsa electrolytic | |
| Li-resistors tse fapaneng le li-capacitor (lipitsa) | |
| Sockets | |
| Reflow soldering | Ee |
| Boholo ba PCB | 14.5 in. x 19.5 in. |
| Min PCB Botenya | 0.2 |
| Fiducial Marks | E ratoa empa ha e hlokehe |
| PCB Qetella: | 1.SMOBC/HASL |
| 2.Khauta ea Electrolytic | |
| 3.Khauta e senang motlakase | |
| 4.Silevera e se nang motlakase | |
| 5.Ho qoelisoa khauta | |
| 6.Tsene ea ho qoelisoa | |
| 7.OSP | |
| Sebopeho sa PCB | Leha e le efe |
| PCB e hlophisitsoeng | 1.Tab e tsamaisitsoe |
| Li-tab tsa 2.Breakaway | |
| 3.V-E fumaneng lintlha | |
| 4.Routed+ V e fumane lintlha | |
| Tlhahlobo | Tlhahlobo ea 1.X-ray |
| 2.Maekorosekopo ho isa ho 20X | |
| Sebetsa hape | 1.BGA ho tlosa le ho nkela sebaka |
| 2.SMT IR rework station | |
| 3.Thru-hole rework station | |
| Firmware | Fana ka lifaele tsa firmware tsa lenaneo, Firmware + litaelo tsa ho kenya software |
| Teko ea mosebetsi | Boemo ba tlhahlobo bo hlokahalang hammoho le litaelo tsa tlhahlobo |
| PCB faele: | Lifaele tsa PCB Altium / Gerber / Eagle (Ho kenyeletsoa lintlha tse kang botenya, botenya ba koporo, 'mala oa mask oa solder, qetello, joalo-joalo) |
Mekhoa ea Tlhahiso
Ho Amoheloa Material → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Tlhahlobo ea Pono → Tlhahlobo e Ikemetseng ea Optical (AOI) → SMT QC Sampling → Material Stock PTH → SMT PTH Mela e Loading → Plated through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping
Taolo ea Boleng
| Teko ea AOI | Licheke bakeng sa pente ea solder E hlahloba likarolo ho fihlela ho 0201 E hlahloba likarolo tse sieo, offset, likarolo tse fosahetseng, polarity |
| Tlhahlobo ea X-Ray | X-Ray e fana ka tlhahlobo e phahameng ea qeto ea: BGAs/Micro BGAs/Chip scale packages /Bare boards |
| Teko ea Potoloho | Teko ea In-Circuit hangata e sebelisoa mmoho le AOI e fokotsang mathata a tšebetso a bakoang ke mathata a likaroloana. |
| Teko ea Matla | Tlhahlobo e tsoetseng pele ea Mosebetsi Lenaneo la Sesebelisoa sa Flash Teko e sebetsang |
IOC tlhahlobo e tlang
SPI solder peista tlhahlobo
Tlhahlobo ea AOI ea inthaneteng
SMT tlhahlobo ea sengoloa sa pele
Kelo ya ka ntle
Tlhahlobo ea X-RAY-welding
BGA sesebelisoa bocha
QA tlhahlobo
Anti-static warehousing le thomello
Setifikeiti
LBH
Moreki e mong le e mong o tla ba le thekiso ea ho ikopanya le uena.Lihora tsa rona tsa ho sebetsa: AM 9:00-PM 19:00 (Nako ea Beijing) ho tloha Mantaha ho fihlela Labohlano.Re tla araba lengolo-tsoibila la hau kapele ka nako ea rona ea ho sebetsa.Hape o ka ikopanya le thekiso ea rona ka mohala oa mohala haeba ho potlakile.
Bili ea thepa (BOM) e hlalosang:
a), linomoro tsa likarolo tsa baetsi,
b), Nomoro ea likarolo tsa bafani ba likarolo (mohlala, Digi-key, Mouser, RS)
c), lifoto tsa mohlala oa PCBA ha ho khoneha.
d), Bongata
ISO9001, ISO14001,UL USA& USA Canada,IFA16949, SGS, RoHS report.
Che, re ke ke ra khonaamohelalifaele tsa setšoantšo, haeba u se na tsonaGerberfaele, na o ka re romella sampole ho e kopitsa.
Mokhoa oa ho kopitsa oa PCB&PCBA:
Mekhoa ea rona ea ho netefatsa boleng ka tlase:
a), Tlhahlobo ea Pono
b), Sesebelisoa se fofang, sesebelisoa sa ho lokisa
c), Taolo ea tšitiso
d), ho lemoha bokhoni ba ho rekisa
e), microscope ea Digital metallog
f), AOI (Automated Optical Inspection)
ABlS e etsa tlhahlobo ea 100% ea pono le AOl hammoho le ho etsa liteko tsa motlakase, tlhahlobo ea motlakase o phahameng, tlhahlobo ea taolo ea impedance, likaroloana tse nyane, tlhahlobo ea mocheso oa mocheso, tlhahlobo ea solder, tlhahlobo ea ho tšepahala, tlhahlobo ea insulating resistance, tlhahlobo ea bohloeki ba ionic le tlhahlobo ea Ts'ebetso ea PCBA.
ABIS e na le sehlopha se inehetseng se ikarabellang bakeng sa tšebeletso ea ka mor'a thekiso.Haeba ho na le bothata leha e le bofe ka mor'a hore sehlahisoa se rekisoe, u ka fana ka maikutlo ho thekiso.Re tla u araba 'me re sebetsane le eona hang ha re fumana lebitso la hau.
ABIS e itšepa haholo ka liboto tsa rona tsa PCB le PCBA, lisebelisoa tsohle le likarolo ke tsona tse ntle ka ho fetisisa le tsa mantlha, sekhahla sa tletlebo ea bareki se tlase haholo.
Sekhahla sa ho fana ka nako se feta 95%
a), Lihora tse 24 li fetoha ka potlako bakeng sa mohlala oa mahlakoreng a mabeli a PCB
b), lihora tse 48 bakeng sa likarolo tse 4-8 tsa mohlala oa PCB
c), hora e 1 bakeng sa qotso
d), lihora tse 2 bakeng sa potso ea moenjiniere / maikutlo a tletlebo
e), lihora tse 7-24 bakeng sa ts'ehetso ea tekheniki / tšebeletso ea taelo / ts'ebetso ea tlhahiso
