Customized FPC High Frequency Anti-metal Electronic Tag
Lintlha tsa Motheo
| Mohlala No. | PCB-A37 |
| Sephutheloana sa lipalangoang | Ho paka ka Vacuum |
| Setifikeiti | UL, ISO9001&14001, SGS, RoHS, Ts16949 |
| Litlhaloso | Sehlopha sa 2 sa IPC |
| Bonyane Sebaka/Mola | 0.075mm/3mil |
| Khoutu ea HS | 85340090 |
| Tšimoloho | E entsoe chaena |
| Bokhoni ba Tlhahiso | 720,000 M2/Selemo |
Tlhaloso ea Sehlahisoa
Flexible hatisitsoeng boto ea potoloho kakaretso
Tlhaloso
Flexible PCB - Flexible Printed Circuit, e bitsoang FPC.
Potoloho e hatisitsoeng e feto-fetohang e ka hlalosoa e le kemiso ea mesaletsa ea conductive e kopantsoeng le substrate e feto-fetohang.E entsoe ka lipaterone tsa li-conductor circuit ho sebelisa mokhoa o bobebe o pepesang phetiso le lits'ebetso tsa etching holim'a substrate e tenyetsehang.
Litšobotsi
Li-circuits tsa Flex tse sebelisoang haholo ho mehala ea cellular, lik'hamera le li-smart wearable.
E ka khona ho lekana hantle le bokhoni ba li-wiring libakeng ho feta liboto tse tloaelehileng tse thata.Mapolanka a potoloho a feto-fetohang a boetse a na le ho hanyetsa hamolemo mocheso o phahameng, ho tšoha le ho thothomela.e na le ts'ebetso e ntle e nang le liphephetso tsa moralo tse kang: li-crossovers tse ke keng tsa qojoa, litlhoko tse khethehileng tsa impedance, ho felisoa ha lipuo tsa sefapano, tšireletso e eketsehileng le bongata bo phahameng ba likarolo.
Hlophisa
PCB ea lehlakore le le leng la flex
flex ea lehlakore le le leng e nang le phihlello e habeli
flex PCB e mahlakoreng a mabeli
Multi-layer flex PCB
Setsebi le Bokhoni
| Ntho | Spec. |
| Mekhahlelo | 1~8 |
| Botenya ba Boto | 0.1mm-0.2mm |
| Substrate Material | PI(0.5mil,1mil,2mil),PET(0.5mil,1mil) |
| Conductive Medium | Foil ea koporo(1/3oz,1/2oz,1oz,2oz) Constantan Peista ea Silver Enke ea Koporo |
| Boholo ba Panel | 600mmx1200mm |
| Min Hole Size | 0.1 limilimithara |
| Min Line Width/Space | 3mil(0.075mm) |
| Boholo ba boholo ba ho kenngoa (phanele e le 'ngoe le habeli) | 610mm*1200mm(Moeli oa ho pepeseha) 250mm * 35mm (feela ntshetsa pele disampole teko) |
| Boholo bo boholo ba ho beoa (phanele e le 'ngoe & phanele e habeli ha ho na enke ea ho omisa ea PTH + e tiileng ea khanya ea UV) | 610*1650mm |
| Hole Hole (Mechanical) | 17um--175um |
| Qetella Hole (Mechanical) | 0.10mm--6.30mm |
| Mamello ea Diameter (Mechanical) | 0.05 limilimithara |
| Ngoliso (Mochini) | 0.075 limilimithara |
| Aspect ratio | 2:1(Bonyane monyetla oa ho bula 0.1mm) 5:1(Bonyane abula ke 0.2mm) 8:1(Bonyane monyetla oa ho bula 0.3mm) |
| SMT Mini.Solder Mask Width | 0.075 limilimithara |
| Mini.Solder Mask Clearance | 0.05 limilimithara |
| Mamello ea Taolo ea Impedans | 10% |
| Qetello ea bokaholimo | ENIG, HASL, Chem.Tin/Sn |
| Mask ea solder / Filimi e Sireletsang | PI(0.5mil,1mil,2mil)(Yellow, White, Black) PET(1mil,2mil) Mask ea solder (e tala, e mosehla, e ntšo ...) |
| Silkscreen | Bokhubelu/Bosehla/Botsho/Bosweu |
| Setifikeiti | UL, ISO 9001, ISO14001, IATF16949 |
| Kopo e khethehileng | Sekhomaretsi(3M467,3M468,3M9077,TESA8853...) |
| Bafani ba Lintho | Shengyi, ITEQ, Taiyo, joalo-joalo. |
| Sephutheloana se Tloaelehileng | Vacuum+Carton |
| Bokhoni ba tlhahiso ea khoeli le khoeli/m² | 60,000 m² |
Nako ea ho etella pele ea Q / T
| Sehlopha | Nako ea Ketapele ka ho Fetisisa | Nako e Tloaelehileng ea ho Tsamaisa |
| E mahlakore a mabeli | Lihora tse 24 | 120hrs |
| 4 Mekhahlelo | 48hrs | 172hrs |
| 6 Mekhahlelo | 72hrs | 192hrs |
| 8 Mekhahlelo | 96hrs | 212hrs |
| 10 Mekhahlelo | 120hrs | lihora tse 268 |
| 12 Layer | 120hrs | 280hrs |
| 14 Mekhahlelo | 144 lihora | 292hrs |
| 16-20 Mekhahlelo | E itšetlehile ka litlhoko tse khethehileng | |
| Ka holimo ho 20 Layers | E itšetlehile ka litlhoko tse khethehileng | |
Taolo ea Boleng
Setifikeiti
LBH
A:Hangata re qotsa hora e le 'ngoe ka mor'a hore re fumane potso ea hau.Haeba u potlakile haholo, ka kopo re letsetse kapa u re bolelle ka lengolo-tsoibila la hau.
Bili ea thepa (BOM) e hlalosang:
a),Mlintlha tsa likarolo tsa anufacturers,
b),CNomoro ea likarolo tsa bafani ba thepa (mohlala, Digi-key, Mouser, RS)
c), lifoto tsa mohlala oa PCBA ha ho khoneha.
d), Bongata
A:Ha se bothata.Haeba u morekisi ea nyane, re lakatsa ho hola le uena 'moho.
A:Ka kakaretso matsatsi a 2-3 bakeng sa ho etsa sampole.Nako ea ho etella pele ea tlhahiso ea bongata e tla itšetleha ka bongata ba taelo le nako eo u behang taelo ka eona.
A:Ka kopo, romella tlhahlobo ea lintlha ho rona, joalo ka Nomoro ea Ntho, Bongata ba ntho ka 'ngoe, Kopo ea Boleng, Letšoao, Melao ea Tefo, Mokhoa oa Lipalangoang, Sebaka sa Ts'ebetso, joalo-joalo. Re tla u etsetsa quotation e nepahetseng kapele kamoo ho ka khonehang.
A:Moreki e mong le e mong o tla ba le thekiso eo a ka ikopanyang le uena ka eona.Lihora tsa rona tsa ho sebetsa: AM 9:00-PM 19:00 (Nako ea Beijing) ho tloha Mantaha ho fihlela Labohlano.Re tla araba lengolo-tsoibila la hau kapele ka nako ea rona ea ho sebetsa.Hape o ka ikopanya le thekiso ea rona ka mohala oa mohala haeba ho potlakile.
A:Ee, re thabetse ho fana ka lisampole tsa mojule ho leka le ho lekola boleng, odara ea sampole e tsoakiloeng ea fumaneha.Ka kopo hlokomela hore moreki o lokela ho lefella litšenyehelo tsa ho romella.
A:e, Re na le sehlopha sa litsebi tsa ho taka seo u ka se tšepang.
A:E, re etsa bonnete ba hore sengoathoana se seng le se seng sa PCB, le PCBA li tla lekoa pele li romelloa, 'me re netefatsa hore thepa eo re e rometseng ka boleng bo botle.
ABlS e etsa tlhahlobo ea pono ea 100% le tlhahlobo ea AOl hammoho le tlhahlobo ea motlakase, tlhahlobo ea motlakase o phahameng, tlhahlobo ea impedance control, likaroloana tse nyane, tlhahlobo ea ho sisinyeha ha mocheso, tlhahlobo ea solder, tlhahlobo ea ho ts'epahala, tlhahlobo ea insulating resistance., tlhahlobo ea bohloeki ba ionicle tlhahlobo ea ts'ebetso ea PCBA.
Liindasteri tse ka Sehloohong tsa ABIS: Taolo ea Liindasteri, Khokahano ea Mehala, Lihlahisoa tsa Likoloi le Bongaka.Mmaraka o ka Sehloohong oa ABIS: 90% Mmaraka oa Machabeng (40% -50% bakeng sa USA, 35% bakeng sa Europe, 5% bakeng sa Russia le 5% -10% bakeng sa Asia Bochabela) le 10% Mmaraka oa Lehae.
