Boto ea potoloho ea Rigid-Flex PCB bakeng sa Bluetooth le Lisebelisoa tse Wearable
Lintlha tsa Motheo
| Mohlala No. | PCB-A31 |
| Sephutheloana sa lipalangoang | Ho paka ka Vacuum |
| Setifikeiti | UL,ISO9001&ISO14001,RoHS |
| Litlhaloso | Sehlopha sa 2 sa IPC |
| Bonyane Sebaka/Mola | 0.075mm/3mil |
| Taolo ea impedance | 50±10% |
| Bokhoni ba Tlhahiso | 720, 000 M2/Selemo |
| Tšimoloho | E entsoe chaena |
Tlhaloso ea Sehlahisoa
Kakaretso ea liboto tsa li-circuits tse hatisitsoeng tse thata-flexible
Tlhaloso ea sebele ea "rigid-flex" e kopanya melemo ea liboto tse tenyetsehang le tse thata.E bonoa e le potoloho e 'ngoe e hokahantsoeng ka likoti tse pharalletseng.Li-circuits tse thata tse feto-fetohang li etsa hore ho be le sekhahla se phahameng sa likarolo ha li ntse li lekana libakeng tse nang le sebopeho se sa tloaelehang.
Liboto tsa li-circuits tse hatisitsoeng tse thata-flex li na le likarolo tse ngata tse feto-fetohang tsa ka hare tse khethiloeng hammoho ho sebelisa filimi ea epoxy pre-preg bonding, e tšoanang le potoloho e feto-fetohang ea multilayer.Li-circuits tse thata li 'nile tsa sebelisoa indastering ea sesole le ea lifofane ka lilemo tse fetang 20.Libotong tse ngata tse thata tsa potoloho ea flex.
Setsebi le Bokhoni
| Ntho | Spec. |
| Mekhahlelo | 1~8 |
| Botenya ba Boto | 0.1mm-8.0mm |
| Lintho tse bonahalang | Polymide, PET, PEN, FR4
|
| Boholo ba Panel | 600mmx1200mm |
| Min Hole Size | 0.1 limilimithara |
| Min Line Width/Space | 3mil(0.075mm) |
| Mamello ea Lethathamo la Boto | Setšoantšo sa 0.10 mm |
| Insulation Layer Teckness | 0.075mm-5.00mm |
| Botenya ba ho Qetela | 0.0024''-0.16'' (0.06-2.4.00mm) |
| Hole Hole (Mechanical) | 17um--175um |
| Qetella Hole (Mechanical) | 0.10mm--6.30mm |
| Mamello ea Diameter (Mechanical) | 0.05 limilimithara |
| Ngoliso (Mochini) | 0.075 limilimithara |
| Aspect ratio | 16:1 |
| Mofuta oa Mask oa Solder | LPI |
| SMT Mini.Solder Mask Width | 0.075 limilimithara |
| Mini.Solder Mask Clearance | 0.05 limilimithara |
| Plug Hole Diameter | 0.25mm--0.60mm |
| Mamello ea Taolo ea Impedans | 10% |
| Qetello ea bokaholimo | ENIG, Chem.Tin/Sn, Khauta ea Flash |
| Maske a solder | Botala / Bosehla / Botsho / Bosoeu / Bofubelu / Boputsoa |
| Silkscreen | Bokhubelu/Bosehla/Botsho/Bosweu |
| Setifikeiti | UL, ISO 9001, ISO14001, IATF16949 |
| Kopo e khethehileng | Lesoba le foufetseng, monoana oa khauta, BGA, enke ea k'habone, maske a shebehang, ts'ebetso ea VIP, plating ea moeli, likoti tse halofo |
| Bafani ba Lintho | Shengyi, ITEQ, Taiyo, joalo-joalo. |
| Sephutheloana se Tloaelehileng | Vacuum+Carton |
ABIS e sebetsana joang le potoloho ea Flex-Rigid?
Bokhoni ba ho bopa kopano ea ho qetela ea li-PCB tse thata le tse tenyetsehang hore li lekane sebaka sa sehlahisoa ke molemong oa mantlha oa liboto tsa lipotoloho tse tenyetsehang.Malebela ke ana a 2 a ho a kenyelletsa morerong oa hau oa moralo o thata-flex:
Eketsa ho ts'epahalla ha trace: Ho kobeha hoo li-circuits tse mamellang ho bolela hore koporo e na le monyetla o moholo oa ho thella ho feta boto e thata.Ho eketsoa ha koporo ho substrate ho tlase ho feta ho FR4 PCB hape.
Matlafatsa mesaletsa le li-vias ka li-teardrops: Haeba e sa laoloe, ho koba substrate ho ka lebisa ho delamination le ho hloleha ha sehlahisoa.Mesaletsa le vias, leha ho le joalo, li ka matlafatsoa ho thibela delamination, le tsona li hlahisa chai e ntle tlhahisong ka ho fana ka mamello e eketsehileng ea ho cheka.
Melemo ka ABIS
- Lisebelisoa tsa boemo bo holimo-mechini e potlakileng ea ho khetha le ho beha sebaka e ka sebetsanang le likarolo tse ka bang 25,000 tsa SMD ka hora.
- Bokhoni bo phahameng ba phepelo ea 60K Sqm khoeli le khoeli-E fana ka molumo o tlase le tlhahiso ea PCB e batloang, le tlhahiso e kholo.
- Sehlopha sa boenjiniere ba litsebi-40 baenjiniere le ntlo ea bona ea lisebelisoa, e matla ho OEM.E fana ka likhetho tse peli tse bonolo: Tsebo ea Tloaelo le e Tloaelehileng ka botebo ka IPC Class II le III Standards
Re fana ka ts'ebeletso e felletseng ea EMS ho bareki ba batlang hore re bokelle PCB ho PCBA, ho kenyeletsoa prototypes, merero ea NPI, le meqolo e nyane le e mahareng.Re boetse re khona ho fumana likarolo tsohle tsa morero oa hau oa kopano oa PCB.Baenjineri ba rona le sehlopha sa bo-rakhoebo ba na le boiphihlelo bo bongata lefapheng la phepelo le indastering ea EMS, ba nang le tsebo e tebileng kopanong ea SMT e re lumellang ho rarolla mathata ohle a tlhahiso.Litšebeletso tsa rona li boloka chelete e ngata, lia tenyetseha ebile lia tšepahala.Re khotsofetse bareki ho pholletsa le liindasteri tse ngata ho kenyeletsa bongaka, indasteri, likoloi, le lisebelisoa tsa motlakase tsa bareki.
Flexible PCB Keta Nako
| Sehlopha se senyenyaneBolumo ≤1 sq mithara | Matsatsi a Tshebetso | Tlhahiso ea 'Misa | Matsatsi a Tshebetso |
| E Mahlakore a le Mong | 3-4 | E Mahlakore a le Mong | 8-10 |
| Likarolo tse 2-4 | 4-5 | Likarolo tse 2-4 | 10-12 |
| 6-8 mekhahlelo | 10-12 | 6-8 mekhahlelo | 14-18 |
ABIS Quality Mission
-E tsoetseng pele thepa LIST
| Teko ea AOI | Lekola bakeng sa solder pasteChecks bakeng sa likarolo ho fihla ho 0201Checks bakeng sa likarolo tse sieo, offset, likarolo tse fosahetseng, polarity |
| Tlhahlobo ea X-Ray | X-Ray e fana ka tlhahlobo ea qeto e phahameng ea: BGAs/Micro BGAs/Package ea Chip scale/Bare boards |
| Teko ea Potoloho | Teko ea In-Circuit hangata e sebelisoa mmoho le AOI e fokotsang mathata a tšebetso a bakoang ke mathata a likaroloana. |
| Teko ea Matla | Tlhahlobo e tsoetseng pele ea Mosebetsi Lenaneo la Sesebelisoa sa Flash Teko e sebetsang |
- IOC tlhahlobo e tlang
- SPI solder peista tlhahlobo
- Tlhahlobo ea AOI ea inthaneteng
- SMT tlhahlobo ea sengoloa sa pele
- Kelo ya ka ntle
- Tlhahlobo ea X-RAY-welding
- BGA sesebelisoa bocha
- QA tlhahlobo
- Anti-static warehousing le thomello
- Phehella 0% tletlebo ka boleng
- Lisebelisoa tsohle tsa lefapha ho latela ISO le lefapha le amanang le lona le tlameha ho fana ka tlaleho ea 8D haeba boto efe kapa efe e ile ea senyeha.
- Liboto tsohle tse tsoang li tlameha ho lekoa ka elektroniki ka 100%, ho lekoa ho thibela le ho soasoa.
- E hlahlojoa ka pono, re etsa tlhahlobo ea microsection pele e romelloa.
- Koetlisa maikutlo a basebetsi le setso sa rona sa khoebo, etsa hore ba thabele mosebetsi oa bona le k'hamphani ea rona, ho molemo ho bona ho hlahisa lihlahisoa tsa boleng bo holimo.
- Lisebelisoa tse tala tsa boleng bo holimo (Shengyi FR4, ITEQ, Taiyo Solder Mask Ink joalo-joalo)
- AOI e ka hlahloba sete kaofela, liboto lia hlahlojoa ka mor'a ts'ebetso ka 'ngoe
Setifikeiti
LBH
Ka kakaretso matsatsi a 2-3 bakeng sa ho etsa lisampole.Nako ea ho etella pele ea tlhahiso ea bongata e tla itšetleha ka bongata ba taelo le nako eo u behang taelo ka eona.
Che, re ke ke ra amohela lifaele tsa setšoantšo, haeba u se na faele ea gerber, na u ka re romella sampole ho e kopitsa.
Mokhoa oa ho kopitsa oa PCB&PCBA:
Mekhoa ea rona ea ho netefatsa boleng ka tlase:
a), Tlhahlobo ea Pono
b), Sesebelisoa se fofang, sesebelisoa sa ho lokisa
c), Taolo ea tšitiso
d), ho lemoha bokhoni ba ho rekisa
e), microscope ea Digital metallog
f), AOI (Automated Optical Inspection)
Ka kakaretso matsatsi a 2-3 bakeng sa ho etsa sampole.Nako ea ho etella pele ea tlhahiso ea bongata e tla itšetleha ka bongata ba taelo le nako eo u behang taelo ka eona.
Mekhoa ea rona ea ho netefatsa boleng ka tlase:
a), Tlhahlobo ea Pono
b), Sesebelisoa se fofang, sesebelisoa sa ho lokisa
c), Taolo ea tšitiso
d), ho lemoha bokhoni ba ho rekisa
e), microscope ea Digital metallog
f), AOI (Automated Optical Inspection)
ISO9001, ISO14001,UL USA& USA Canada,IFA16949, SGS, RoHS report.
Liindasteri tse ka Sehloohong tsa ABIS: Taolo ea Liindasteri, Khokahano ea Mehala, Lihlahisoa tsa Likoloi le Bongaka.Mmaraka o ka Sehloohong oa ABIS: 90% Mmaraka oa Machabeng (40% -50% bakeng sa USA, 35% bakeng sa Europe, 5% bakeng sa Russia le 5% -10% bakeng sa Asia Bochabela) le 10% Mmaraka oa Lehae.
Ka kopo, romella tlhahlobo ea lintlha ho rona, joalo ka Nomoro ea Ntho, Bongata ba ntho ka 'ngoe, Kopo ea Boleng, Letšoao, Melao ea Tefo, Mokhoa oa Lipalangoang, Sebaka sa Ts'ebetso, joalo-joalo. Re tla u etsetsa quotation e nepahetseng kapele kamoo ho ka khonehang.
Sekhahla sa ho fana ka nako se feta 95%
a), Lihora tse 24 li fetoha ka potlako bakeng sa mohlala oa mahlakoreng a mabeli a PCB
b), lihora tse 48 bakeng sa likarolo tse 4-8 tsa mohlala oa PCB
c), hora e 1 bakeng sa qotso
d), lihora tse 2 bakeng sa potso ea moenjiniere / maikutlo a tletlebo
e), lihora tse 7-24 bakeng sa ts'ehetso ea tekheniki / tšebeletso ea taelo / ts'ebetso ea tlhahiso
