Customizable 6 Layers Rigid-Flex PCB Board e nang le 3.0oz Copper le ENIG 2u” Surface Finish
Lintlha tsa Motheo
| Mohlala No. | PCB-A35 |
| Sephutheloana sa lipalangoang | Ho paka ka Vacuum |
| Setifikeiti | UL,ISO9001&ISO14001,RoHS |
| Litlhaloso | Sehlopha sa 2 sa IPC |
| Bonyane Sebaka/Mola | 0.075mm/3mil |
| Taolo ea impedance | 50±10% |
| Bokhoni ba Tlhahiso | 720, 000 M2/Selemo |
| Tšimoloho | E entsoe chaena |
Tlhaloso ea Sehlahisoa
Kakaretso ea liboto tsa li-circuits tse hatisitsoeng tse thata-flexible
Tlhaloso ea sebele ea "rigid-flex" e kopanya melemo ea liboto tse tenyetsehang le tse thata.E bonoa e le potoloho e 'ngoe e hokahantsoeng ka likoti tse pharalletseng.Li-circuits tse thata tse feto-fetohang li etsa hore ho be le sekhahla se phahameng sa likarolo ha li ntse li lekana libakeng tse nang le sebopeho se sa tloaelehang.
Liboto tsa li-circuits tse hatisitsoeng tse thata-flex li na le likarolo tse ngata tse feto-fetohang tsa ka hare tse khethiloeng hammoho ho sebelisa filimi ea epoxy pre-preg bonding, e tšoanang le potoloho e feto-fetohang ea multilayer.Li-circuits tse thata li 'nile tsa sebelisoa indastering ea sesole le ea lifofane ka lilemo tse fetang 20.Libotong tse ngata tse thata tsa potoloho ea flex.
Setsebi le Bokhoni
| Ntho | Bokhoni ba Tlhahiso |
| Layer Counts | 1-32 |
| Lintho tse bonahalang | FR-4, High TG FR-4, PTFE, Aluminium Base, Cu base, Rogers, Teflon, joalo-joalo. |
| Boholo ba Boholo | 600mm X1200mm |
| Mamello ea Lethathamo la Boto | ± 0.13 limilimithara |
| Botenya ba Boto | 0.20mm-8.00mm |
| Mamello ea Botenya(t≥0.8mm) | ±10% |
| Botenya ba Tolerancc(t<0.8mm) | ±0.1mm |
| Insulation Layer Thickncss | 0.075mm-5.00mm |
| Bonyane Iine | 0.075 limilimithara |
| Bonyane Sebaka | 0.075 limilimithara |
| Out Layer Koporo Botenya | 18um-350um |
| Lera le ka Hare Botenya ba Koporo | 17um--175um |
| Sekoti sa ho Epa(Mechanical) | 0.15mm--6.35mm |
| Qete lesoba(Mechanical) | 0.10mm--6.30mm |
| Mamello ea Diameter(Mechanical) | 0.05 limilimithara |
| Ngoliso(Mechanical) | 0.075 limilimithara |
| Aspecl Karolelano | 16:01 |
| Mofuta oa Mask oa Solder | LPI |
| SMT Mini.Solder Mask Width | 0.075 limilimithara |
| Mini.Solder Mask Clearance | 0.05 limilimithara |
| Plug Hole Diameter | 0.25mm--0.60mm |
| Mamello ea Taolo ea Impedans | 10% |
| Surface Finish | HASL/HASL-LF, ENIG, Tin ea ho qoelisoa/Silver, Flash Gold, OSP, monoana oa khauta, khauta e thata |
Bokhoni ba Tlhahiso- (Flex)
| lintho | unit | ||||||
| Maemo a maholo | Lera | 10 | |||||
| Thepa ea motheo (Polymide) | μm | 9, 12, 18, 35, 70 | |||||
| Foil ea koporo | μm | 18,35,70 | |||||
| Sekoahelo (Polymide) | μm | 27.5, 37.5, 50, 75 | |||||
| Thermosetting Cement | μm | 13, 25 | |||||
| Boholo ba Panel | mm | 250*800 | 250 * 1500 bakeng sa Mekhahlelo e 10 | ||||
| Boholo ba Panel | mm | E itšetlehile ka moreki | |||||
| Boholo bo Felletse Botenya ba Boto | mm | 0.7 | |||||
| Botenya ba Boto bo Feletseng | mm | 0.057 limilimithara | |||||
| Mamello ea boholo ba lesoba | mm | ± 0.05 limilimithara | |||||
| Bonyane ka Hole | mm | 0.1 limilimithara | |||||
| Bonyane ka Hole Pad | mm | 0.3 limilimithara | 0.25 limilimithara ka ho khetheha | ||||
| Maximal Base Botenya ba Koporo | OZ | 2 | |||||
| Bonyane Botenya ba Koporo ea Base | OZ | 1/4 | |||||
| Botenya ba Copper Plating | μm | 8-20 | |||||
| PTH Botenya ba Koporo | μm | 8-20 | |||||
| Bonnyane Bophara ba Mola/Sepakapaka | mm | 0.05 | |||||
| Sebaka se Felisitsoe | / | Ke, Au, Sn | |||||
Flexible PCB Keta Nako
| Sehlopha se senyenyaneBolumo ≤1 sq mithara | Matsatsi a Tshebetso | Tlhahiso ea 'Misa | Matsatsi a Tshebetso |
| E Mahlakore a le Mong | 3-4 | E Mahlakore a le Mong | 8-10 |
| Likarolo tse 2-4 | 4-5 | Likarolo tse 2-4 | 10-12 |
| 6-8 mekhahlelo | 10-12 | 6-8 mekhahlelo | 14-18 |
Melemo ea ABIS
- Lisebelisoa tsa boemo bo holimo-mechini e potlakileng ea ho khetha le ho beha sebaka e ka sebetsanang le likarolo tse ka bang 25,000 tsa SMD ka hora.
- Bokhoni bo phahameng ba phepelo ea 60K Sqm khoeli le khoeli-E fana ka molumo o tlase le tlhahiso ea PCB e batloang, le tlhahiso e kholo.
- Sehlopha sa boenjiniere ba litsebi-40 baenjiniere le ntlo ea bona ea lisebelisoa, e matla ho OEM.E fana ka likhetho tse peli tse bonolo: Tsebo ea Tloaelo le e Tloaelehileng ka botebo ka IPC Class II le III Standards
Re fana ka ts'ebeletso e felletseng ea EMS ho bareki ba batlang hore re bokelle PCB ho PCBA, ho kenyeletsoa prototypes, merero ea NPI, meqolo e nyane le e mahareng.Re boetse re khona ho fumana likarolo tsohle tsa morero oa hau oa kopano oa PCB.Baenjineri ba rona le sehlopha sa bo-rakhoebo ba na le boiphihlelo bo bongata lefapheng la phepelo le indastering ea EMS, ba nang le tsebo e tebileng kopanong ea SMT e re lumellang ho rarolla mathata ohle a tlhahiso.Litšebeletso tsa rona li boloka chelete e ngata, lia tenyetseha ebile lia tšepahala.Re khotsofetse bareki ho pholletsa le liindasteri tse ngata ho kenyeletsa bongaka, indasteri, likoloi, le lisebelisoa tsa motlakase tsa bareki.
Setifikeiti
LBH
Liindasteri tse ka Sehloohong tsa ABIS: Taolo ea Liindasteri, Khokahano ea Mehala, Lihlahisoa tsa Likoloi le Bongaka.Mmaraka o ka Sehloohong oa ABIS: 90% Mmaraka oa Machabeng (40% -50% bakeng sa USA, 35% bakeng sa Europe, 5% bakeng sa Russia le 5% -10% bakeng sa Asia Bochabela) le 10% Mmaraka oa Lehae.
Main Suppliers(FR4): Kingboard (Hong Kong), NanYa (Taiwan), le Shengyi (Chaena), Haeba ba bang, ka kopo RFQ.
Mekhoa ea rona ea ho netefatsa boleng ka tlase:
a), Tlhahlobo ea Pono
b), Sesebelisoa se fofang, sesebelisoa sa ho lokisa
c), Taolo ea tšitiso
d), ho lemoha bokhoni ba ho rekisa
e), microscope ea Digital metallog
f), AOI (Automated Optical Inspection)
Ka kakaretso matsatsi a 2-3 bakeng sa ho etsa sampole.Nako ea ho etella pele ea tlhahiso ea bongata e tla itšetleha ka bongata ba taelo le nako eo u behang taelo ka eona.
Mekhoa ea rona ea ho netefatsa boleng ka tlase:
a), Tlhahlobo ea Pono
b), Sesebelisoa se fofang, sesebelisoa sa ho lokisa
c), Taolo ea tšitiso
d), ho lemoha bokhoni ba ho rekisa
e), microscope ea Digital metallog
f), AOI (Automated Optical Inspection)
ABlS e etsa tlhahlobo ea pono ea 100% le tlhahlobo ea AOl hammoho le tlhahlobo ea motlakase, tlhahlobo ea motlakase o phahameng, tlhahlobo ea impedance control, likaroloana tse nyane, tlhahlobo ea ho sisinyeha ha mocheso, tlhahlobo ea solder, tlhahlobo ea ho ts'epahala, tlhahlobo ea insulating resistance., tlhahlobo ea bohloeki ba ionicle tlhahlobo ea ts'ebetso ea PCBA.
ABlS e etsa tlhahlobo ea 100% ea pono le AOl hammoho le ho etsa liteko tsa motlakase, tlhahlobo ea motlakase o phahameng, tlhahlobo ea taolo ea impedance, likaroloana tse nyane, tlhahlobo ea mocheso oa mocheso, tlhahlobo ea solder, tlhahlobo ea ho tšepahala, tlhahlobo ea insulating resistance, tlhahlobo ea bohloeki ba ionic le tlhahlobo ea Ts'ebetso ea PCBA.
ABIS ha e na litlhoko tsa MOQ bakeng sa PCB kapa PCBA.
Sekhahla sa ho fana ka nako se feta 95%
a), Lihora tse 24 li fetoha ka potlako bakeng sa mohlala oa mahlakoreng a mabeli a PCB
b), lihora tse 48 bakeng sa likarolo tse 4-8 tsa mohlala oa PCB
c), hora e 1 bakeng sa qotso
d), lihora tse 2 bakeng sa potso ea moenjiniere / maikutlo a tletlebo
e), lihora tse 7-24 bakeng sa ts'ehetso ea tekheniki / tšebeletso ea taelo / ts'ebetso ea tlhahiso
