6 Layers FR4 HDI PCB Circuit in 2oz copper with Immersion Tin Surface e Felisitsoe
Lintlha tsa Motheo
| Mohlala No. | PCB-A12 |
| Sephutheloana sa lipalangoang | Ho paka ka Vacuum |
| Setifikeiti | UL,ISO9001&ISO14001,RoHS |
| Kopo | Lisebelisoa tsa elektronike tsa bareki |
| Bonyane Sebaka/Mola | 0.075mm/3mil |
| Bokhoni ba Tlhahiso | 50,000 sqm/ khoeli |
| Khoutu ea HS | 853400900 |
| Tšimoloho | E entsoe chaena |
Tlhaloso ea Sehlahisoa
Selelekela sa HDI PCB
HDI PCB e hlalosoa e le boto ea potoloho e hatisitsoeng e nang le lithapo tse phahameng ka ho fetisisa sebakeng sa yuniti ho feta PCB e tloaelehileng.Ba na le mela e metle haholo le libaka, li-vias tse nyane le li-pads tsa ho hapa, le likhokahano tse phahameng tsa khokahano ho feta tse sebelisoang ho mahlale a tloaelehileng a PCB.Li-PCB tsa HDI li entsoe ka li-microvias, tse patiloeng ka li-vias le lamination ka tatellano e nang le lisebelisoa tsa ho kenya letsoho le likhoele tsa khomphutha bakeng sa lits'ebetso tse phahameng tsa ho tsamaisa.
Lisebelisoa
HDI PCB e sebelisoa ho fokotsa boholo le boima ba 'mele, hammoho le ho ntlafatsa ts'ebetso ea motlakase ea sesebelisoa.HDI PCB ke khetho e ntle ka ho fetisisa bakeng sa palo e phahameng ea lera le theko e phahameng ea maemo a holimo kapa liboto tsa laminated sequentially.HDI e kenyelletsa li-vias tse foufetseng le tse patiloeng tse thusang ho boloka thepa ea thepa ea PCB ka ho lumella likarolo le mela ho etsoa ka holimo kapa ka tlaase ho tsona ntle le ho etsa khokahanyo.Bongata ba semelo sa kajeno sa BGA le likaroloana tsa "flip-chip" ha li lumelle ho tsamaisa mesaletsa lipakeng tsa BGA pads.Li-vias tse foufetseng le tse patiloeng li tla kopanya likaroloana tse hlokang likhokahano sebakeng seo.
Setsebi le Bokhoni
| Ntho | Bokhoni ba Tlhahiso |
| Layer Counts | Likarolo tse 1-20 |
| Lintho tse bonahalang | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, joalo-joalo. |
| Botenya ba boto | 0.10mm-8.00mm |
| Boholo ba Boholo | 600mmX1200mm |
| Mamello ea Lethathamo la Boto | + 0.10 limilimithara |
| Mamello ea Botenya(t≥0.8mm) | ±8% |
| Mamello ea Botenya(t<0.8mm) | ±10% |
| Insulation Layer Teckness | 0.075mm-5.00mm |
| Minimum Line | 0.075 limilimithara |
| Sebaka se fokolang | 0.075 limilimithara |
| Out Layer Koporo Botenya | 18um-350um |
| Lera le ka Hare Botenya ba Koporo | 17um--175um |
| Sekoti sa ho Epa(Mechanical) | 0.15mm--6.35mm |
| Qete lesoba(Mechanical) | 0.10mm-6.30mm |
| Mamello ea Diameter(Mechanical) | 0.05 limilimithara |
| Ngoliso(Mechanical) | 0.075 limilimithara |
| Aspect ratio | 16:1 |
| Mofuta oa Mask oa Solder | LPI |
| SMT Mini.Solder Mask Width | 0.075 limilimithara |
| Mini.Solder Mask Clearance | 0.05 limilimithara |
| Plug Hole Diameter | 0.25mm--0.60mm |
| Taolo ea impedance Ho mamellana | ±10% |
| Bokaholimo/phekolo | HASL, ENIG, Chem, Tin, Flash Gold, OSP, Monoana oa Khauta |
Mokhoa oa Tlhahiso ea PCB
Ts'ebetso e qala ka ho rala Sebopeho sa PCB ho sebelisa software efe kapa efe ea meralo ea PCB / CAD Tool (Proteus, Eagle, Kapa CAD).
Mehato e meng kaofela ke ea Ts'ebetso ea Tlhahiso ea Boto ea Potoloho e Hatelitsoeng e ts'oana le Single Sided PCB kapa Double Sided PCB kapa Multi-layer PCB.
Nako ea ho etella pele ea Q / T
| Sehlopha | Nako ea Ketapele ka ho Fetisisa | Nako e Tloaelehileng ea ho Tsamaisa |
| E mahlakore a mabeli | Lihora tse 24 | 120hrs |
| 4 Mekhahlelo | 48hrs | 172hrs |
| 6 Mekhahlelo | 72hrs | 192hrs |
| 8 Mekhahlelo | 96hrs | 212hrs |
| 10 Mekhahlelo | 120hrs | lihora tse 268 |
| 12 Layer | 120hrs | 280hrs |
| 14 Mekhahlelo | 144 lihora | 292hrs |
| 16-20 Mekhahlelo | E itšetlehile ka litlhoko tse khethehileng | |
| Ka holimo ho 20 Layers | E itšetlehile ka litlhoko tse khethehileng | |
Ho falla ha ABIS ho laola FR4 PCBS
Ho lokisetsa lesoba
Ho tlosa lithōle ka hloko le ho lokisa liparamente tsa mochini oa ho phunya: pele o roala ka koporo, ABIS e ela hloko likoti tsohle ho FR4 PCB e tšoaroang ho tlosa litšila, ho se tsitse ha holim'a metsi le epoxy smear, masoba a hloekileng a tiisa hore ho khomarela ka katleho maboteng a lesoba. .hape, qalong ea ts'ebetso, litekanyetso tsa mochini oa drill li lokisoa ka nepo.
Ho Lokisoa ha Sebaka
Ho senya ka hloko: basebetsi ba rona ba theknoloji ba nang le phihlelo ba tla tseba esale pele hore tsela e le 'ngoe feela ea ho qoba liphello tse mpe ke ho lebella tlhokahalo ea ho sebetsana ka mokhoa o khethehileng le ho nka mehato e nepahetseng ho netefatsa hore ts'ebetso e etsoa ka hloko le ka nepo.
Litefiso tsa Katoloso ea Mocheso
E tloaetse ho sebetsana le lisebelisoa tse fapaneng, ABIS e tla khona ho sekaseka motsoako ho netefatsa hore o loketse.ebe ho boloka ts'epo ea nako e telele ea CTE (coefficient of thermal extension), e nang le CTE e ka tlaase, ho ka etsahala hore ebe e pentiloe ka likoti ke ho hlōleha ho tsoa ka makhetlo a mangata ka koporo e etsang li-interconnections tsa lera la ka hare.
Katoloso
ABIS laola potoloho e scaled-up ke liphesente tse tsebahalang ka tebello ea tahlehelo ena e le hore le dikarolo tla khutlela litekanyo bona e le-e etselitsoeng ka mor'a hore potoloho lamination ka ho feletseng.hape, ho sebelisa likhothaletso tsa motheo tsa sekala sa moetsi oa laminate hammoho le ka hare ho ntlo ya data dipalopalo taolo ya tshebetso, ho daela-ka lintlha sekaleng e tla ba ka tsela e lumellanang ha nako e ntse e ka hare ho tikoloho eo e itseng ea tlhahiso.
Mochini
Ha nako e fihla ea ho haha PCB ea hau, ABIS etsa bonnete ba hore u khetha e na le lisebelisoa tse nepahetseng le boiphihlelo ba ho e hlahisa
ABIS Quality Mission
Sekhahla sa ho feta sa thepa e kenang ka holimo ho 99.9%, palo ea litekanyetso tsa ho hana ka bongata ka tlase ho 0.01%.
Mehaho e netefalitsoeng ea ABIS e laola lits'ebetso tsohle tsa bohlokoa ho felisa litaba tsohle tse ka bang teng pele li hlahisoa.
ABIS e sebelisa software e tsoetseng pele ho etsa tlhahlobo e batsi ea DFM mabapi le data e kenang, 'me e sebelisa mekhoa e tsoetseng pele ea taolo ea boleng ho pholletsa le ts'ebetso ea tlhahiso.
ABIS e etsa tlhahlobo ea 100% ea pono le ea AOI hammoho le ho etsa tlhahlobo ea motlakase, tlhahlobo ea matla a phahameng a motlakase, tlhahlobo ea taolo ea impedance, likaroloana tse nyane, tlhahlobo ea mocheso oa mocheso, tlhahlobo ea solder, tlhahlobo ea ho tšepahala, tlhahlobo ea insulate resistance le tlhahlobo ea bohloeki ba ionic.
Setifikeiti
LBH
Boholo ba bona ba tsoa ho Shengyi Technology Co., Ltd. (SYTECH), eo e kileng ea e-ba moetsi oa bobeli oa CCL lefatšeng ka bophara ho latela boholo ba thekiso, ho tloha 2013 ho ea ho 2017. Re thehile likamano tsa nako e telele tsa tšebelisano ho tloha 2006. The FR4 resin material (Model S1000-2, S1141, S1165, S1600) li sebelisoa haholo-holo bakeng sa ho etsa liboto tsa potoloho tse hatisitsoeng ka mahlakoreng a mabeli hammoho le liboto tse nang le mekhahlelo e mengata.Lintlha tse mabapi le litšupiso tsa hau ke tsena.
Bakeng sa FR-4: Sheng Yi, King Board, Nan Ya, Polycard, ITEQ, ISOLA
Bakeng sa CEM-1 & CEM 3: Sheng Yi, King Board
Bakeng sa Maqhubu a Phahameng: Sheng Yi
Bakeng sa Pheko ea UV: Tamura, Chang Xing ( * 'Mala o teng: Botala) Solder bakeng sa Lehlakore le le leng
Bakeng sa Senepe sa Mokelikeli: Tao Yang, Resist (Filimi e Metsi)
Chuan Yu ( * Mebala e teng : E tšoeu, e ka nahanoang ka Solder e Yellow, Purple, Red, Blue, Green, Black)
),1 Hora qotso
b), lihora tse 2 tsa maikutlo a tletlebo
c), 7 * 24 hora tšehetso botekgeniki
d), 7*24 tšebeletso ea taelo
e), 7 * 24 lihora tsa ho fana
f), 7*24 tlhahiso ea matha
Che, re ke ke ra amohela lifaele tsa setšoantšo, haeba u se na faele ea Gerber, na u ka re romella sampole ho e kopitsa.
Mokhoa oa ho kopitsa PCB&PCBA:
Mekhoa ea rona ea ho netefatsa boleng ka tlase:
a), Tlhahlobo ea Pono
b), Sesebelisoa se fofang, sesebelisoa sa ho lokisa
c), Taolo ea tšitiso
d), ho lemoha bokhoni ba ho rekisa
e), Digital metallo graphic microscope
f), AOI (Automated Optical Inspection)
E hlahlobiloe nakong ea lihora tse 12.Hang ha potso ea Moenjiniere le faele e sebetsang e hlahlobiloe, re tla qala tlhahiso.
Sheba haufi le uena.Lihlahisoa tse ngata li tsoa Chaena.Ho hlakile hore sena se na le mabaka a 'maloa.Ha e sa le ka theko feela.
Ho lokisetsa mantsoe a qotsitsoeng ho etsoa kapele.
Litaelo tsa tlhahiso li phethoa kapele.U ka rera liodara tse reriloeng likhoeli esale pele, re ka li hlophisa hang ha PO e netefalitsoe.
Ketane ea phepelo e atolohile haholo.Ke kahoo re ka rekang karolo e 'ngoe le e' ngoe ho molekane ea khethehileng kapele haholo.
Basebetsi ba tenyetsehang le ba chesehang.Ka lebaka leo, re amohela taelo e 'ngoe le e 'ngoe.
24 tšebeletso ea inthaneteng bakeng sa litlhoko tse potlakileng.Ho sebetsa lihora tse +10 ka letsatsi.
Litšenyehelo tse tlase.Ha ho litšenyehelo tse patiloeng.Boloka ho basebetsi, chelete e ngata le thepa.
ABIS ha e na litlhoko tsa MOQ bakeng sa PCB kapa PCBA.
ABlS e etsa tlhahlobo ea 100% ea pono le AOl hammoho le ho etsa liteko tsa motlakase, tlhahlobo ea motlakase o phahameng, tlhahlobo ea taolo ea impedance, likaroloana tse nyane, tlhahlobo ea mocheso oa mocheso, tlhahlobo ea solder, tlhahlobo ea ho tšepahala, tlhahlobo ea insulating resistance, tlhahlobo ea bohloeki ba ionic le tlhahlobo ea Ts'ebetso ea PCBA.
ABIS ha e na litlhoko tsa MOQ bakeng sa PCB kapa PCBA.
| Bokhoni ba tlhahiso ea lihlahisoa tse rekisoang tse chesang | |
| Habeli Side/Multilayer PCB Workshop | Aluminium PCB Workshop |
| Bokhoni ba Tekheniki | Bokhoni ba Tekheniki |
| Lisebelisoa tse tala: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Lisebelisoa tse tala: Aluminium base, Copper base |
| Lera: 1 lera ho 20 Layers | Lera: 1 lera le 2 Layers |
| Min.line bophara/sebaka: 3mil/3mil(0.075mm/0.075mm) | Min.line bophara/sebaka: 4mil/4mil(0.1mm/0.1mm) |
| Min.Soba sa boholo: 0.1mm(sekoti sa dirilling) | Min.Boholo ba lesoba: 12mil(0.3mm) |
| Max.Boto ea boholo: 1200mm * 600mm | Boholo ba Boto: 1200mm* 560mm(47in* 22in) |
| Botenya ba boto bo felile: 0.2mm- 6.0mm | E felile botenya ba boto: 0.3 ~ 5mm |
| Botenya ba koporo ea foil: 18um ~ 280um (0.5oz ~ 8oz) | Botenya ba koporo ea foil: 35um ~ 210um (1oz ~ 6oz) |
| Mamello ea lesoba la NPTH: +/-0.075mm, Mamello ea lesoba la PTH: +/-0.05mm | Ho mamella boemo ba lesoba: +/-0.05mm |
| Mamello ea kemiso: +/-0.13mm | Mamello ea kemiso ea litsela: +/ 0.15mm;ho mamella kemiso ea ho otla: +/ 0.1mm |
| Bokaholimo bo felile: HASL e se nang lead, khauta e qoelisoang(ENIG), silevera e qoelisoang, OSP, ho penta ka khauta, monoana oa khauta, INK ea Carbon. | Bokaholimo bo felile: HASL ea mahala, khauta e qoelisoang (ENIG), silevera ea ho qoelisoa, OSP jj |
| Mamello ea taolo ea impedance: +/-10% | Lula ho mamella botenya: +/-0.1mm |
| Bokhoni ba tlhahiso: 50,000 sqm / khoeli | MC PCB Bokhoni ba tlhahiso: 10,000 sqm / khoeli |
