4oz Multilayer FR4 PCB Board ho ENIG e sebelisoang ho Indasteri ea Matla le IPC Sehlopha sa 3
Lintlha tsa tlhahiso
| Mohlala No. | PCB-A9 |
| Sephutheloana sa lipalangoang | Ho paka ka Vacuum |
| Setifikeiti | UL,ISO9001&ISO14001,RoHS |
| Kopo | Lisebelisoa tsa elektronike tsa bareki |
| Bonyane Sebaka/Mola | 0.075mm/3mil |
| Bokhoni ba Tlhahiso | 50,000 sqm/ khoeli |
| Khoutu ea HS | 853400900 |
| Tšimoloho | E entsoe chaena |
Tlhaloso ea Sehlahisoa
FR4 PCB Selelekela
Tlhaloso
FR e bolela "lelakabe le thibelang mollo," FR-4 (kapa FR4) ke lebitso la sehlopha sa NEMA bakeng sa lisebelisoa tse matlafalitsoeng ka khalase ea epoxy laminate, thepa e kopantsoeng e entsoeng ka lesela le lohiloeng la fiberglass e nang le epoxy resin binder e etsang hore e be substrate e loketseng bakeng sa lisebelisoa tsa elektroniki. letlapeng la potoloho le hatisitsoeng.
Melemo le Bokhopo ba FR4 PCB
Lisebelisoa tsa FR-4 li tumme haholo ka lebaka la litšoaneleho tse ngata tse makatsang tse ka thusang liboto tsa potoloho tse hatisitsoeng.Ntle le ho theko e tlaase le ho sebetsa habonolo, ke insulator ea motlakase e nang le matla a phahameng haholo a dielectric.Ho feta moo, e tšoarella, ha e na mongobo, ha e na mocheso ebile e bobebe.
FR-4 ke thepa e bohlokoa haholo, e tsebahalang haholo ka theko ea eona e tlase le botsitso ba mochini le motlakase.Le hoja thepa ena e na le melemo e mengata 'me e fumaneha ka mefuta e fapaneng ea botenya le boholo, ha se khetho e ntle ka ho fetisisa bakeng sa ts'ebeliso e' ngoe le e 'ngoe, haholo-holo lisebelisoa tsa maqhubu a phahameng joaloka meralo ea RF le microwave.
Sebopeho sa PCB se nang le mefuta e mengata
Li-PCB tsa Multilayer li eketsa ho rarahana le ho teteana ha meralo ea PCB ka ho eketsa likarolo tse ling ho feta likarolo tse holimo le tse tlase tse bonoang libotong tse mahlakore a mabeli.Multilayer PCBs li hahiloe ka laminating le dikarolo tse sa tšoaneng.Likarolo tse ka hare, tseo hangata li nang le mapolanka a potoloho a mahlakoreng a mabeli, li koaletsoe hammoho, 'me li na le likarolo tse sireletsang pakeng le pakeng tsa foil ea koporo bakeng sa likarolo tse ka ntle.Likoti tse phuntsoeng ka boto (ka tsela) li tla etsa likhokahano le likarolo tse fapaneng tsa boto.
Setsebi le Bokhoni
| Ntho | Bokhoni ba Tlhahiso |
| Layer Counts | Likarolo tse 1-20 |
| Lintho tse bonahalang | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, joalo-joalo. |
| Botenya ba boto | 0.10mm-8.00mm |
| Boholo ba Boholo | 600mmX1200mm |
| Mamello ea Lethathamo la Boto | + 0.10 limilimithara |
| Mamello ea Botenya(t≥0.8mm) | ±8% |
| Mamello ea Botenya(t<0.8mm) | ±10% |
| Insulation Layer Teckness | 0.075mm-5.00mm |
| Minimum Line | 0.075 limilimithara |
| Sebaka se fokolang | 0.075 limilimithara |
| Out Layer Koporo Botenya | 18um-350um |
| Lera le ka Hare Botenya ba Koporo | 17um--175um |
| Sekoti sa ho Epa(Mechanical) | 0.15mm--6.35mm |
| Qete lesoba(Mechanical) | 0.10mm-6.30mm |
| Mamello ea Diameter(Mechanical) | 0.05 limilimithara |
| Ngoliso(Mechanical) | 0.075 limilimithara |
| Aspect ratio | 16:1 |
| Mofuta oa Mask oa Solder | LPI |
| SMT Mini.Solder Mask Width | 0.075 limilimithara |
| Mini.Solder Mask Clearance | 0.05 limilimithara |
| Plug Hole Diameter | 0.25mm--0.60mm |
| Taolo ea impedance Ho mamellana | ±10% |
| Bokaholimo/phekolo | HASL, ENIG, Chem, Tin, Flash Gold, OSP, Monoana oa Khauta |
Nako ea ho etella pele ea Q / T
| Sehlopha | Nako ea Ketapele ka ho Fetisisa | Nako e Tloaelehileng ea ho Tsamaisa |
| E mahlakore a mabeli | Lihora tse 24 | 120hrs |
| 4 Mekhahlelo | 48hrs | 172hrs |
| 6 Mekhahlelo | 72hrs | 192hrs |
| 8 Mekhahlelo | 96hrs | 212hrs |
| 10 Mekhahlelo | 120hrs | lihora tse 268 |
| 12 Layer | 120hrs | 280hrs |
| 14 Mekhahlelo | 144 lihora | 292hrs |
| 16-20 Mekhahlelo | E itšetlehile ka litlhoko tse khethehileng | |
| Ka holimo ho 20 Layers | E itšetlehile ka litlhoko tse khethehileng | |
Ho falla ha ABIS ho laola FR4 PCBS
Ho lokisetsa lesoba
Ho tlosa lithōle ka hloko le ho lokisa liparamente tsa mochini oa ho phunya: pele o roala ka koporo, ABIS e ela hloko likoti tsohle ho FR4 PCB e tšoaroang ho tlosa litšila, ho se tsitse ha holim'a metsi le epoxy smear, masoba a hloekileng a tiisa hore ho khomarela ka katleho maboteng a lesoba. .hape, qalong ea ts'ebetso, litekanyetso tsa mochini oa drill li lokisoa ka nepo.
Ho Lokisoa ha Sebaka
Ho senya ka hloko: basebetsi ba rona ba theknoloji ba nang le phihlelo ba tla tseba esale pele hore tsela e le 'ngoe feela ea ho qoba liphello tse mpe ke ho lebella tlhokahalo ea ho sebetsana ka mokhoa o khethehileng le ho nka mehato e nepahetseng ho netefatsa hore ts'ebetso e etsoa ka hloko le ka nepo.
Litefiso tsa Katoloso ea Mocheso
E tloaetse ho sebetsana le lisebelisoa tse fapaneng, ABIS e tla khona ho sekaseka motsoako ho netefatsa hore o loketse.ebe ho boloka ts'epo ea nako e telele ea CTE (coefficient of thermal extension), e nang le CTE e ka tlaase, ho ka etsahala hore ebe e pentiloe ka likoti ke ho hlōleha ho tsoa ka makhetlo a mangata ka koporo e etsang li-interconnections tsa lera la ka hare.
Katoloso
ABIS laola potoloho e scaled-up ke liphesente tse tsebahalang ka tebello ea tahlehelo ena e le hore le dikarolo tla khutlela litekanyo bona e le-e etselitsoeng ka mor'a hore potoloho lamination ka ho feletseng.hape, ho sebelisa likhothaletso tsa motheo tsa sekala sa moetsi oa laminate hammoho le ka hare ho ntlo ya data dipalopalo taolo ya tshebetso, ho daela-ka lintlha sekaleng e tla ba ka tsela e lumellanang ha nako e ntse e ka hare ho tikoloho eo e itseng ea tlhahiso.
Mochini
Ha nako e fihla ea ho haha PCB ea hau, ABIS etsa bonnete ba hore u khetha e na le lisebelisoa tse nepahetseng le boiphihlelo ho e hlahisa ka nepo tekong ea pele.
PCB Product & Thepa Show
PCB e thata, Flexible PCB, Rigid-Flex PCB, HDI PCB, Kopano ea PCB
ABIS Quality Mission
Lisebelisoa tse tsoetseng pele LIST
| Teko ea AOI | E lekola li-solder pasteChecks bakeng sa likarolo ho fihla ho 0201 E hlahloba likarolo tse sieo, offset, likarolo tse fosahetseng, polarity |
| Tlhahlobo ea X-Ray | X-Ray e fana ka tlhahlobo ea qeto e phahameng ea: BGAs/Micro BGAs/Package ea Chip scale/Bare boards |
| Teko ea Potoloho | Teko ea In-Circuit hangata e sebelisoa mmoho le AOI e fokotsang mathata a tšebetso a bakoang ke mathata a likaroloana. |
| Teko ea Matla | Advanced Function TestFlash Device Programming Teko e sebetsang |
IOC tlhahlobo e tlang
SPI solder peista tlhahlobo
Tlhahlobo ea AOI ea inthaneteng
SMT tlhahlobo ea sengoloa sa pele
Kelo ya ka ntle
Tlhahlobo ea X-RAY-welding
BGA sesebelisoa bocha
QA tlhahlobo
Anti-static warehousing le thomello
Pursue 0% tletlebo ka boleng
Lisebelisoa tsohle tsa lefapha ho latela ISO le lefapha le amanang le lona le tlameha ho fana ka tlaleho ea 8D haeba boto efe kapa efe e ile ea senyeha.
Liboto tsohle tse tsoang li tlameha ho lekoa ka elektroniki ka 100%, ho lekoa ho thibela le ho soasoa.
E hlahlojoa ka pono, re etsa tlhahlobo ea microsection pele e romelloa.
Koetlisa maikutlo a basebetsi le setso sa rona sa khoebo, etsa hore ba thabele mosebetsi oa bona le k'hamphani ea rona, ho molemo ho bona ho hlahisa lihlahisoa tsa boleng bo holimo.
Lisebelisoa tse tala tsa boleng bo holimo (Shengyi FR4, ITEQ, Taiyo Solder Mask Ink joalo-joalo)
AOI e ka hlahloba sete kaofela, liboto lia hlahlojoa ka mor'a ts'ebetso ka 'ngoe
Setifikeiti
LBH
Ho netefatsa qotso e nepahetseng, etsa bonnete ba hore o kenyelletsa lintlha tse latelang bakeng sa projeke ea hau:
Tlatsa lifaele tsa GERBER ho kenyelletsa le lenane la BOM
l Bongata
l Nako ea ho fetoha
l Litlhoko tsa Panelization
l Litlhoko tsa Lisebelisoa
l Qetella litlhoko
l Khoutu ea hau ea tloaelo e tla fanoa ka lihora tse 2-24 feela, ho latela ho rarahana ha moralo.
Moreki e mong le e mong o tla ba le thekiso ea ho ikopanya le uena.Lihora tsa rona tsa ho sebetsa: AM 9:00-PM 19:00 (Nako ea Beijing) ho tloha Mantaha ho fihlela Labohlano.Re tla araba lengolo-tsoibila la hau kapele ka nako ea rona ea ho sebetsa.Hape o ka ikopanya le thekiso ea rona ka mohala oa mohala haeba ho potlakile.
ISO9001, ISO14001,UL USA& USA Canada,IFA16949, SGS, RoHS report.
Mekhoa ea rona ea ho netefatsa boleng ka tlase:
a), Tlhahlobo ea Pono
b), Sesebelisoa se fofang, sesebelisoa sa ho lokisa
c), Taolo ea tšitiso
d), ho lemoha bokhoni ba ho rekisa
e), Digital metallo graphic microscope
f), AOI (Automated Optical Inspection)
Ee, re thabetse ho fana ka lisampole tsa mojule ho leka le ho lekola boleng, odara ea sampole e tsoakiloeng ea fumaneha.Ka kopo hlokomela hore moreki o lokela ho lefella litšenyehelo tsa ho romella.
Sekhahla sa ho fana ka nako se feta 95%
a), Lihora tse 24 li fetoha ka potlako bakeng sa mohlala oa mahlakoreng a mabeli a PCB
b), lihora tse 48 bakeng sa likarolo tse 4-8 tsa mohlala oa PCB
c), hora e 1 bakeng sa qotso
d), lihora tse 2 bakeng sa potso ea moenjiniere / maikutlo a tletlebo
e), lihora tse 7-24 bakeng sa ts'ehetso ea tekheniki / tšebeletso ea taelo / ts'ebetso ea tlhahiso
ABIS ha ho mohla e khethang litaelo.Ka bobeli li-odara tse nyane le tsa Mass li amohelehile 'me Re ABIS re tla ba le boikarabello le ho ba le boikarabelo, le ho sebeletsa bareki ka boleng le bongata.
ABlS e etsa tlhahlobo ea 100% ea pono le AOl hammoho le ho etsa liteko tsa motlakase, tlhahlobo ea motlakase o phahameng, tlhahlobo ea taolo ea impedance, likaroloana tse nyane, tlhahlobo ea mocheso oa mocheso, tlhahlobo ea solder, tlhahlobo ea ho tšepahala, tlhahlobo ea insulating resistance, tlhahlobo ea bohloeki ba ionic le tlhahlobo ea Ts'ebetso ea PCBA.
a), 1 Hora qotso
b), lihora tse 2 tsa maikutlo a tletlebo
c), 7 * 24 hora tšehetso botekgeniki
d), 7*24 tšebeletso ea taelo
e), 7 * 24 lihora tsa ho fana
f), 7*24 tlhahiso ea matha
| Bokhoni ba tlhahiso ea lihlahisoa tse rekisoang tse chesang | |
| Habeli Side/Multilayer PCB Workshop | Aluminium PCB Workshop |
| Bokhoni ba Tekheniki | Bokhoni ba Tekheniki |
| Lisebelisoa tse tala: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Lisebelisoa tse tala: Aluminium base, Copper base |
| Lera: 1 lera ho 20 Layers | Lera: 1 lera le 2 Layers |
| Min.line bophara/sebaka: 3mil/3mil(0.075mm/0.075mm) | Min.line bophara/sebaka: 4mil/4mil(0.1mm/0.1mm) |
| Min.Soba sa boholo: 0.1mm(sekoti sa dirilling) | Min.Boholo ba lesoba: 12mil(0.3mm) |
| Max.Boto ea boholo: 1200mm * 600mm | Boholo ba Boto: 1200mm* 560mm(47in* 22in) |
| Botenya ba boto bo felile: 0.2mm- 6.0mm | E felile botenya ba boto: 0.3 ~ 5mm |
| Botenya ba koporo ea foil: 18um ~ 280um (0.5oz ~ 8oz) | Botenya ba koporo ea foil: 35um ~ 210um (1oz ~ 6oz) |
| Mamello ea lesoba la NPTH: +/-0.075mm, Mamello ea lesoba la PTH: +/-0.05mm | Ho mamella boemo ba lesoba: +/-0.05mm |
| Mamello ea kemiso: +/-0.13mm | Mamello ea kemiso ea litsela: +/ 0.15mm;ho mamella kemiso ea ho otla: +/ 0.1mm |
| Bokaholimo bo felile: HASL e se nang lead, khauta e qoelisoang(ENIG), silevera e qoelisoang, OSP, ho penta ka khauta, monoana oa khauta, INK ea Carbon. | Bokaholimo bo felile: HASL ea mahala, khauta e qoelisoang (ENIG), silevera ea ho qoelisoa, OSP jj |
| Mamello ea taolo ea impedance: +/-10% | Lula ho mamella botenya: +/-0.1mm |
| Bokhoni ba tlhahiso: 50,000 sqm / khoeli | MC PCB Bokhoni ba tlhahiso: 10,000 sqm / khoeli |
