4 Layers 2.0mm botenya le1oz Copper Green Mask Printed Circuit Assembly Board
Lintlha tsa tlhahiso
| Mohlala No. | PCB-A41 |
| Sephutheloana sa lipalangoang | Ho paka ka Vacuum |
| Setifikeiti | UL,ISO9001&ISO14001,RoHS |
| Litlhaloso | Sehlopha sa 2 sa IPC |
| Bonyane Sebaka/Mola | 0.075mm/3mil |
| Tšimoloho | E entsoe chaena |
| Bokhoni ba Tlhahiso | 720,000 M2/Selemo |
| Kopo | Electronics ea bareki |
Tlhaloso ea Sehlahisoa
Selelekela sa Merero ea PCBA
Khamphani ea ABIS CIRCUITS e fana ka lits'ebeletso, eseng lihlahisoa feela.Re fana ka tharollo, eseng feela thepa.
Ho tloha tlhahiso ea PCB, likarolo tse rekang ho ea ho likarolo lia bokana.E kenyeletsa:
PCB Tloaelo
Setšoantšo sa PCB / moralo ho latela setšoantšo sa hau sa moralo
Tlhahiso ea PCB
Ho fumana likarolo
Khokahano ea PCB
PCBA 100% teko
Melemo ea Rōna
Lisebelisoa tsa boemo bo holimo-mechini e potlakileng ea ho khetha le ho beha sebaka e ka sebetsanang le likarolo tse ka bang 25,000 tsa SMD ka hora.
Bokhoni bo phahameng ba phepelo ea 60K Sqm khoeli le khoeli-E fana ka molumo o tlase le tlhahiso ea PCB e batloang, le lihlahisoa tse kholo.
Sehlopha sa boenjiniere ba litsebi-40 baenjiniere le ntlo ea bona ea lisebelisoa, e matla ho OEM.E fana ka likhetho tse peli tse bonolo: Tsebo ea Tloaelo le e Tloaelehileng ka botebo ka IPC Class II le III Standards
Re fana ka ts'ebeletso e felletseng ea EMS ho bareki ba batlang hore re bokelle PCB ho PCBA, ho kenyeletsoa prototypes, morero oa NPI, molumo o monyane le o mahareng.Re boetse re khona ho fumana likarolo tsohle tsa morero oa hau oa kopano oa PCB.Baenjineri ba rona le sehlopha sa mehloli ba na le boiphihlelo bo bongata indastering ea phepelo le indastering ea EMS, ba nang le tsebo e tebileng kopanong ea SMT e lumellang ho rarolla mathata ohle a tlhahiso.Litšebeletso tsa rona li boloka chelete e ngata, lia tenyetseha ebile lia tšepahala.Re khotsofetse bareki ho pholletsa le liindasteri tse ngata ho kenyeletsa bongaka, indasteri, likoloi le lisebelisoa tsa motlakase tsa bareki.
Matla a PCBA
| 1 | Kopano ea SMT ho kenyelletsa kopano ea BGA |
| 2 | Li-chips tse amoheloang tsa SMD: 0204, BGA, QFP, QFN, TSOP |
| 3 | Bophahamo ba karolo: 0.2-25mm |
| 4 | Pakete e nyane: 0204 |
| 5 | Sebaka se fokolang har'a BGA : 0.25-2.0mm |
| 6 | Min BGA boholo: 0.1-0.63mm |
| 7 | Sebaka sa Min QFP: 0.35mm |
| 8 | Min kopano boholo: (X * Y): 50 * 30mm |
| 9 | Boholo ba kopano: (X * Y): 350 * 550mm |
| 10 | Ho nepahala ha ho khethoa: ± 0.01mm |
| 11 | Bokhoni ba ho beha: 0805, 0603, 0402 |
| 12 | Li-pin count e phahameng li fumaneha |
| 13 | Bokhoni ba SMT ka letsatsi: lintlha tse 80,000 |
Bokhoni - SMT
| Mela | 9(5 Yamaha,4KME) |
| Bokhoni | Ho beoa ha limilione tse 52 ka khoeli |
| Boholo ba Boto | 457*356mm.(18"X14") |
| Boholo ba Karolo e nyane | 0201-54 sq.mm.(0.084 sq.inch), sehokelo se selelele,CSP,BGA,QFP |
| Lebelo | 0.15 sec/chip,0.7 sec/QFP |
Bokhoni - PTH
| Mela | 2 |
| Bophara bo phahameng ba boto | 400 limilimithara |
| Mofuta | Maqhubu a mabeli |
| Boemo ba Pbs | Tšehetso ea mohala o sa lefelloeng |
| Mocheso o phahameng haholo | 399 likhato C |
| Fafatsa phallo | keketso |
| Ho chesa pele | 3 |
Mekhoa ea Tlhahiso
Ho Amoheloa Material → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Tlhahlobo ea Pono → Tlhahlobo e Ikemetseng ea Optical (AOI) → SMT QC Sampling → Material Stock PTH → SMT PTH Mela e Loading → Plated through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping
Taolo ea Boleng
| Teko ea AOI | Licheke bakeng sa pente ea solder E hlahloba likarolo ho fihlela ho 0201 E hlahloba likarolo tse sieo, offset, likarolo tse fosahetseng, polarity |
| Tlhahlobo ea X-Ray | X-Ray e fana ka tlhahlobo e phahameng ea qeto ea: BGAs/Micro BGAs/Chip scale packages /Bare boards |
| Teko ea Potoloho | Teko ea In-Circuit hangata e sebelisoa mmoho le AOI e fokotsang mathata a tšebetso a bakoang ke mathata a likaroloana. |
| Teko ea Matla | Tlhahlobo e tsoetseng pele ea Mosebetsi Lenaneo la Sesebelisoa sa Flash Teko e sebetsang |
Setifikeiti
LBH
| Sehlopha | Nako ea Ketapele ka ho Fetisisa | Nako e Tloaelehileng ea ho Tsamaisa |
| E mahlakore a mabeli | Lihora tse 24 | 120hrs |
| 4 Mekhahlelo | 48hrs | 172hrs |
| 6 Mekhahlelo | 72hrs | 192hrs |
| 8 Mekhahlelo | 96hrs | 212hrs |
| 10 Mekhahlelo | 120hrs | lihora tse 268 |
| 12 Layer | 120hrs | 280hrs |
| 14 Mekhahlelo | 144 lihora | 292hrs |
| 16-20 Mekhahlelo | E itšetlehile ka litlhoko tse khethehileng | |
| Ka holimo ho 20 Layers | E itšetlehile ka litlhoko tse khethehileng | |
Bili ea thepa (BOM) e hlalosang:
a), linomoro tsa likarolo tsa baetsi,
b), Nomoro ea likarolo tsa bafani ba likarolo (mohlala, Digi-key, Mouser, RS)
c), lifoto tsa mohlala oa PCBA ha ho khoneha.
d), Bongata
| Bokhoni ba tlhahiso ea lihlahisoa tse rekisoang tse chesang | |
| Habeli Side/Multilayer PCB Workshop | Aluminium PCB Workshop |
| Bokhoni ba Tekheniki | Bokhoni ba Tekheniki |
| Lisebelisoa tse tala: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Lisebelisoa tse tala: Aluminium base, Copper base |
| Lera: 1 lera ho 20 Layers | Lera: 1 lera le 2 Layers |
| Min.line bophara/sebaka: 3mil/3mil(0.075mm/0.075mm) | Min.line bophara/sebaka: 4mil/4mil(0.1mm/0.1mm) |
| Min.Soba sa boholo: 0.1mm(sekoti sa dirilling) | Min.Boholo ba lesoba: 12mil(0.3mm) |
| Max.Boto ea boholo: 1200mm * 600mm | Boholo ba Boto: 1200mm* 560mm(47in* 22in) |
| Botenya ba boto bo felile: 0.2mm- 6.0mm | E felile botenya ba boto: 0.3 ~ 5mm |
| Botenya ba koporo ea foil: 18um ~ 280um (0.5oz ~ 8oz) | Botenya ba koporo ea foil: 35um ~ 210um (1oz ~ 6oz) |
| Mamello ea lesoba la NPTH: +/-0.075mm, Mamello ea lesoba la PTH: +/-0.05mm | Ho mamella boemo ba lesoba: +/-0.05mm |
| Mamello ea kemiso: +/-0.13mm | Mamello ea kemiso ea litsela: +/ 0.15mm;ho mamella kemiso ea ho otla: +/ 0.1mm |
| Bokaholimo bo felile: HASL e se nang lead, khauta e qoelisoang(ENIG), silevera e qoelisoang, OSP, ho penta ka khauta, monoana oa khauta, INK ea Carbon. | Bokaholimo bo felile: HASL ea mahala, khauta e qoelisoang (ENIG), silevera ea ho qoelisoa, OSP jj |
| Mamello ea taolo ea impedance: +/-10% | Lula ho mamella botenya: +/-0.1mm |
| Bokhoni ba tlhahiso: 50,000 sqm / khoeli | MC PCB Bokhoni ba tlhahiso: 10,000 sqm / khoeli |
Che, re ke ke ra khonaamohelalifaele tsa setšoantšo, haeba u se na tsonaGerberfaele, na o ka re romella sampole ho e kopitsa.
Mokhoa oa ho kopitsa oa PCB&PCBA:
Mekhoa ea rona ea ho netefatsa boleng ka tlase:
a), Tlhahlobo ea Pono
b), Sesebelisoa se fofang, sesebelisoa sa ho lokisa
c), Taolo ea tšitiso
d), ho lemoha bokhoni ba ho rekisa
e), microscope ea Digital metallog
f), AOI (Automated Optical Inspection)
ABlS e etsa tlhahlobo ea 100% ea pono le AOl hammoho le ho etsa liteko tsa motlakase, tlhahlobo ea motlakase o phahameng, tlhahlobo ea taolo ea impedance, likaroloana tse nyane, tlhahlobo ea mocheso oa mocheso, tlhahlobo ea solder, tlhahlobo ea ho tšepahala, tlhahlobo ea insulating resistance, tlhahlobo ea bohloeki ba ionic le tlhahlobo ea Ts'ebetso ea PCBA.
Liindasteri tse ka Sehloohong tsa ABIS: Taolo ea Liindasteri, Khokahano ea Mehala, Lihlahisoa tsa Likoloi le Bongaka.Mmaraka o ka Sehloohong oa ABIS: 90% Mmaraka oa Machabeng (40% -50% bakeng sa USA, 35% bakeng sa Europe, 5% bakeng sa Russia le 5% -10% bakeng sa Asia Bochabela) le 10% Mmaraka oa Lehae.
Sekhahla sa ho fana ka nako se feta 95%
a), Lihora tse 24 li fetoha ka potlako bakeng sa mohlala oa mahlakoreng a mabeli a PCB
b), lihora tse 48 bakeng sa likarolo tse 4-8 tsa mohlala oa PCB
c), hora e 1 bakeng sa qotso
d), lihora tse 2 bakeng sa potso ea moenjiniere / maikutlo a tletlebo
e), lihora tse 7-24 bakeng sa ts'ehetso ea tekheniki / tšebeletso ea taelo / ts'ebetso ea tlhahiso
·Ka ABIS, bareki ba fokotsa litšenyehelo tsa bona tsa theko ea lefatše haholo le ka nepo.Ka morao ho ts'ebeletso e 'ngoe le e' ngoe e fanoang ke ABIS, ho patiloe ho boloka litšenyehelo bakeng sa bareki.
.Re na le mabenkele a mabeli 'moho, le leng ke la prototype, le rekoa kapele, le ho etsa molumo o monyane.E 'ngoe ke ea tlhahiso ea bongata hape bakeng sa boto ea HDI, e nang le basebetsi ba hloahloa ba hloahloa, bakeng sa lihlahisoa tsa boleng bo holimo tse nang le litheko tsa tlholisano le ho fana ka nako ka nako.
.Re fana ka thekiso e hloahloa haholo, tšehetso ea tekheniki le ea thepa, lefatšeng ka bophara ka lihora tse 24 tsa maikutlo a litletlebo.
