OEM 2 Layers Flexible ENIG Circuit Board
Lintlha tsa Motheo
| Mohlala No. | PCB-24 |
| Sephutheloana sa lipalangoang | Ho paka ka Vacuum |
| Setifikeiti | UL, ISO9001&14001, SGS, RoHS, Ts16949 |
| Litlhaloso | Sehlopha sa 2 sa IPC |
| Bonyane Sebaka/Mola | 0.075mm/3mil |
| Khoutu ea HS | 85340090 |
| Tšimoloho | E entsoe chaena |
| Bokhoni ba Tlhahiso | 720,000 M2/Selemo |
Mokhoa oa Tlhahiso
Li-PCB tse feto-fetohang ke mofuta o mocha oa boto ea potoloho e hatisitsoeng e khonang ho koba, ho sotha le ho kobeha ntle le ho senya potoloho.Setsing sa rona sa tlhahiso sa PCB se Shenzhen, China, re fana ka mefuta e mengata e fapaneng ea li-PCB tse tenyetsehang, ho kenyeletsoa mofuta oa rona oa 2-layer flexible PCB no.PCB-A24.
PCB ea rona ea 2-layer flexible PCB e na le boholo ba 34.62mm * 250.40mm 'me e entsoe ka thepa ea motheo ea PI (polyimide), e nang le botenya ba 0.3mm le botenya ba koporo ba 1.0oz.
PCB ea rona ea 2-layer e tenyetsehang e etselitsoe ho kopana le litlhaloso tsa IPC Class2, ho netefatsa ho ts'epahala le boleng ba eona bo holimo.E netefalitsoe ke UL, ISO9001&14001, SGS, RoHS, le Ts16949, e etsa hore e tšoanelehe bakeng sa mefuta e mengata ea likopo, ho kenyeletsoa liindasteri tsa likoloi, tsa bongaka, tsa indasteri le tsa sefofane.
Setsing sa rona, re sebelisa theknoloji ea morao-rao ea tlhahiso le lisebelisoa ho netefatsa hore li-PCB tsa rona tse tenyetsehang li hlahisoa ka nepo le ka bokhabane.PCB ea rona ea 2-layer flexible PCB e pakiloe bakeng sa lipalangoang tse bolokehileng 'me e fumaneha ka liodara tse ngata.
Ka bokhutšoanyane, PCB ea rona ea 2-layer flexible PCB ke boto ea potoloho e hatisitsoeng ea boleng bo holimo, e ka tšeptjoang, le e tšoarellang nako e telele e ka fihlelang maemo a boima a indasteri.Haeba u batla PCB e feto-fetohang bakeng sa projeke ea hau, u se ke ua sheba hole le mofuta oa rona oa 2-layer flexible PCB no.PCB-A24.
Setsebi le Bokhoni
| Ntho | Spec. |
| Mekhahlelo | 1~8 |
| Botenya ba Boto | 0.1mm-0.2mm |
| Substrate Material | PI(0.5mil,1mil,2mil),PET(0.5mil,1mil) |
| Conductive Medium | Foil ea koporo(1/3oz,1/2oz,1oz,2oz) Constantan Peista ea Silver Enke ea Koporo |
| Boholo ba Panel | 600mmx1200mm |
| Min Hole Size | 0.1 limilimithara |
| Min Line Width/Space | 3mil(0.075mm) |
| Boholo ba boholo ba ho kenngoa (phanele e le 'ngoe le habeli) | 610mm*1200mm(Moeli oa ho pepeseha) 250mm * 35mm (feela ntshetsa pele disampole teko) |
| Boholo bo boholo ba ho beoa (phanele e le 'ngoe & phanele e habeli ha ho na enke ea ho omisa ea PTH + e tiileng ea khanya ea UV) | 610*1650mm |
| Hole Hole (Mechanical) | 17um--175um |
| Qetella Hole (Mechanical) | 0.10mm--6.30mm |
| Mamello ea Diameter (Mechanical) | 0.05 limilimithara |
| Ngoliso (Mochini) | 0.075 limilimithara |
| Aspect ratio | 2:1(Bonyane monyetla oa ho bula 0.1mm) 5:1(Bonyane abula ke 0.2mm) 8:1(Bonyane monyetla oa ho bula 0.3mm) |
| SMT Mini.Solder Mask Width | 0.075 limilimithara |
| Mini.Solder Mask Clearance | 0.05 limilimithara |
| Mamello ea Taolo ea Impedans | 10% |
| Qetello ea bokaholimo | ENIG, HASL, Chem.Tin/Sn |
| Mask ea solder / Filimi e Sireletsang | PI(0.5mil,1mil,2mil)(Yellow, White, Black) PET(1mil,2mil) Mask ea solder (e tala, e mosehla, e ntšo ...) |
| Silkscreen | Bokhubelu/Bosehla/Botsho/Bosweu |
| Setifikeiti | UL, ISO 9001, ISO14001, IATF16949 |
| Kopo e khethehileng | Sekhomaretsi(3M467,3M468,3M9077,TESA8853...) |
| Bafani ba Lintho | Shengyi, ITEQ, Taiyo, joalo-joalo. |
| Sephutheloana se Tloaelehileng | Vacuum+Carton |
| Bokhoni ba tlhahiso ea khoeli le khoeli/m² | 60,000 m² |
ABIS e sebetsana joang le Mathata a Flexible PCB?
Ntho ea pele eo re e netefatsang ke lisebelisoa tse nepahetseng ho hlahisa boto ea hau.Ka mor'a moo, basebetsi ba ile ba ba le phihlelo e lekaneng ea ho sebetsana le phephetso ea ho etsa liboto tse tenyetsehang.
Ho bula mask a solder kapa ho koahela mehato e lekaneng-e fapaneng ea ts'ebetso ho ka fetola tsela eo boto e tenyetsehang e shebahalang ka eona.Etching le plating li ka fetola sebopeho sa PCB, ke ka lebaka leo u lokelang ho etsa bonnete ba hore menyetla e holimo ke ea bophara bo loketseng.
Khetha thepa ka hloko, hape u nahane ka lintho tse ling, tse kang boholo, boima, le botšepehi ba boto.
Laola sebaka se loketseng sa manonyeletso a solder le ntlha ea ho kobeha - motsoako oa solder o lokela ho ba sebaka se hlokahalang ho tloha moo ho kobehang.Haeba u li beha haufi haholo, delamination kapa solder pad e ka 'na ea etsahala.
Control Solder pad spacing - ABIS etsa bonnete ba hore ho na le sebaka se lekaneng pakeng tsa mekatelo le mesaletsa conductive haufi le bona, e le hore ho qoba lamination tahlehelo.
Nako ea ho etella pele ea Q / T
| Sehlopha | Nako ea Ketapele ka ho Fetisisa | Nako e Tloaelehileng ea ho Tsamaisa |
| E mahlakore a mabeli | Lihora tse 24 | 120hrs |
| 4 Mekhahlelo | 48hrs | 172hrs |
| 6 Mekhahlelo | 72hrs | 192hrs |
| 8 Mekhahlelo | 96hrs | 212hrs |
| 10 Mekhahlelo | 120hrs | lihora tse 268 |
| 12 Layer | 120hrs | 280hrs |
| 14 Mekhahlelo | 144 lihora | 292hrs |
| 16-20 Mekhahlelo | E itšetlehile ka litlhoko tse khethehileng | |
| Ka holimo ho 20 Layers | E itšetlehile ka litlhoko tse khethehileng | |
Taolo ea Boleng
Sekhahla sa ho feta sa thepa e kenang ka holimo ho 99.9%, palo ea litekanyetso tsa ho hana ka bongata ka tlase ho 0.01%.
Mehaho e netefalitsoeng ea ABIS e laola lits'ebetso tsohle tsa bohlokoa ho felisa litaba tsohle tse ka bang teng pele li hlahisoa.
ABIS e sebelisa software e tsoetseng pele ho etsa tlhahlobo e batsi ea DFM mabapi le data e kenang, 'me e sebelisa mekhoa e tsoetseng pele ea taolo ea boleng ho pholletsa le ts'ebetso ea tlhahiso.
ABIS e etsa tlhahlobo ea 100% ea pono le ea AOI hammoho le ho etsa tlhahlobo ea motlakase, tlhahlobo ea matla a phahameng a motlakase, tlhahlobo ea taolo ea impedance, likaroloana tse nyane, tlhahlobo ea mocheso oa mocheso, tlhahlobo ea solder, tlhahlobo ea ho tšepahala, tlhahlobo ea insulate resistance le tlhahlobo ea bohloeki ba ionic.
Setifikeiti
LBH
Mekhoa ea rona ea ho netefatsa boleng joalo ka tlase:
a), Tlhahlobo ea Pono
b),Flying probe, fixture tool
c), Taolo ea impedance
d), Ho lemoha bokhoni ba Solder
e), microscope ea Digital metallogric
f), AOI(Tlhahlobo e Ikemetseng ea Optical)
Bili ea thepa (BOM) e hlalosang:
a),Mlintlha tsa likarolo tsa anufacturers,
b),CNomoro ea likarolo tsa bafani ba thepa (mohlala, Digi-key, Mouser, RS)
c), lifoto tsa mohlala oa PCBA ha ho khoneha.
d), Bongata
A:Ha se bothata.Haeba u morekisi ea nyane, re lakatsa ho hola le uena 'moho.
A:Ka kakaretso matsatsi a 2-3 bakeng sa ho etsa sampole.Nako ea ho etella pele ea tlhahiso ea bongata e tla itšetleha ka bongata ba taelo le nako eo u behang taelo ka eona.
Che, re ke ke ra amohela lifaele tsa setšoantšo, haeba u se na faele ea gerber, na u ka re romella sampole ho e kopitsa.
Mokhoa oa ho kopitsa oa PCB&PCBA:
A:Moreki e mong le e mong o tla ba le thekiso eo a ka ikopanyang le uena ka eona.Lihora tsa rona tsa ho sebetsa: AM 9:00-PM 19:00 (Nako ea Beijing) ho tloha Mantaha ho fihlela Labohlano.Re tla araba lengolo-tsoibila la hau kapele ka nako ea rona ea ho sebetsa.Hape o ka ikopanya le thekiso ea rona ka mohala oa mohala haeba ho potlakile.
a), 1 Hora qotso
b), lihora tse 2 tsa maikutlo a tletlebo
c), 7 * 24 hora tšehetso botekgeniki
d),7*24 tšebeletso ea odara
e), phano ea lihora tse 7 * 24
f),7*24 tlhahiso ea tlhahiso
A:e, Re na le sehlopha sa litsebi tsa ho taka seo u ka se tšepang.
Sekhahla sa ho fana ka nako se feta 95%
a), Lihora tse 24 li fetoha ka potlako bakeng sa mohlala oa mahlakoreng a mabeli a PCB
b),48hours bakeng sa 4-8 le dikarolo mohlala PCB
c),1 hora bakeng sa qotso
d), Lihora tse 2 bakeng sa potso ea moenjiniere / maikutlo a tletlebo
e), lihora tsa 7-24 bakeng sa ts'ehetso ea tekheniki / tšebeletso ea taelo / ts'ebetso ea tlhahiso
ABlS e etsa tlhahlobo ea pono ea 100% le tlhahlobo ea AOl hammoho le tlhahlobo ea motlakase, tlhahlobo ea motlakase o phahameng, tlhahlobo ea impedance control, likaroloana tse nyane, tlhahlobo ea ho sisinyeha ha mocheso, tlhahlobo ea solder, tlhahlobo ea ho ts'epahala, tlhahlobo ea insulating resistance., tlhahlobo ea bohloeki ba ionicle tlhahlobo ea ts'ebetso ea PCBA.
Liindasteri tse ka Sehloohong tsa ABIS: Taolo ea Liindasteri, Khokahano ea Mehala, Lihlahisoa tsa Likoloi le Bongaka.Mmaraka o ka Sehloohong oa ABIS: 90% Mmaraka oa Machabeng (40% -50% bakeng sa USA, 35% bakeng sa Europe, 5% bakeng sa Russia le 5% -10% bakeng sa Asia Bochabela) le 10% Mmaraka oa Lehae.
