Ho latela mokhoa oa kopano, likarolo tsa elektroniki li ka aroloa ka likarolo tsa "hole" le "surface mount components" (SMC)..Empa ka har'a indasteri,Lisebelisoa tsa Surface Mount Devices (SMDs) e sebelisoa ho feta ho hlalosa sena bokahodimokarolo tse leng e sebelisoang ka lisebelisoa tsa elektroniki tse kentsoeng ka kotloloho holim'a boto ea potoloho e hatisitsoeng (PCB).Li-SMD li tla ka mekhoa e fapaneng ea ho paka, e 'ngoe le e' ngoe e etselitsoe merero e itseng, mathata a sebaka le litlhoko tsa tlhahiso.Mona ke mefuta e meng e tloaelehileng ea liphutheloana tsa SMD:
1. Liphutheloana tsa SMD Chip (Rectangular):
SOIC (Small Outline Integrated Circuit): Sephutheloana se nang le mahlakore a mabeli se nang le li-gull-wing lead ka mahlakoreng a mabeli, se loketseng lipotoloho tse kopantsoeng.
SSOP (Shrink Small Outline Package): E ts'oana le SOIC empa e na le boholo bo bonyenyane ba 'mele le molumo o motle haholoanyane.
TSSOP (Sephutheloana sa Thin Shrink Small Outline): Mofuta o mosesane oa SSOP.
QFP (Quad Flat Package): Sephutheloana se sekoere kapa sa khutlonnetsepa se nang le loto ka mahlakoreng 'ohle a mane.E ka ba ea boemo bo tlase (LQFP) kapa e ntle haholo (VQFP).
LGA (Land Grid Array): Ha ho ba etellang pele;ho e-na le hoo, lipampiri tsa ho kopana li hlophisitsoe ka marang-rang holim'a metsi a ka tlaase.
2. Liphutheloana tsa SMD Chip (Square):
CSP (Chip Scale Package): E kopane haholo ka libolo tsa solder ka kotloloho mathōkong a karolo.E etselitsoe ho ba haufi le boholo ba chip ea 'nete.
BGA (Ball Grid Array): Libolo tsa solder tse hlophisitsoeng ka har'a marang-rang ka tlas'a sephutheloana, tse fanang ka ts'ebetso e babatsehang ea mocheso le motlakase.
FBGA (Fine-Pitch BGA): E ts'oana le BGA empa e na le molumo o motle bakeng sa boima bo phahameng ba likarolo.
3. Liphutheloana tsa SMD Diode le Transistor:
SOT (Small Outline Transistor): Sephutheloana se senyenyane sa diode, transistors, le likaroloana tse ling tse nyane tsa discrete.
SOD (Small Outline Diode): E tšoana le SOT empa ka ho khetheha bakeng sa diode.
ETSA (Diode Outline): Liphutheloana tse fapaneng tse nyane tsa diode le likarolo tse ling tse nyane.
4.Liphutheloana tsa SMD Capacitor le Resistor:
0201, 0402, 0603, 0805, joalo-joalo: Tsena ke linomoro tsa linomoro tse emelang litekanyo tsa karolo ho karolo ea leshome ea millimeter.Ka mohlala, 0603 e bolela karolo ea boholo ba 0.06 x 0.03 inches (1.6 x 0.8 mm).
5. Liphutheloana tse ling tsa SMD:
PLCC (Plastiki Leaded Chip Carrier): Sephutheloana se sekoere kapa se nang le mahlakore a mabeli se nang le li-lead ka mahlakoreng 'ohle a mane, se loketseng li-IC le likarolo tse ling.
TO252, TO263, joalo-joalo: Tsena ke mefuta ea SMD ea liphutheloana tsa likarolo tsa setso tse kang TO-220, TO-263, tse nang le botlaaseng bo bataletseng bakeng sa ho beoa holimo.
E 'ngoe le e' ngoe ea mefuta ena ea liphutheloana e na le melemo le mathata a eona ho latela boholo, boiketlo ba kopano, ts'ebetso ea mocheso, litšobotsi tsa motlakase le litšenyehelo.Khetho ea sephutheloana sa SMD e ipapisitse le lintlha tse kang ts'ebetso ea karolo, sebaka se fumanehang sa boto, bokhoni ba ho etsa thepa le litlhoko tsa mocheso.
Nako ea poso: Aug-24-2023
