Network Access Control PCB boto Controller PCBA Board bakeng Telecommunication Industry
Lintlha tsa tlhahiso
| Mohlala No. | PCB-A44 |
| Mokhoa oa kopano | SMT |
| Sephutheloana sa lipalangoang | Anti-static Packaging |
| Setifikeiti | UL, ISO9001&14001, SGS, RoHS, Ts16949 |
| Litlhaloso | Sehlopha sa 2 sa IPC |
| Bonyane Sebaka/Mola | 0.075mm/3mil |
| Kopo | Puisano |
| Tšimoloho | E entsoe chaena |
| Bokhoni ba Tlhahiso | 720,000 M2/Selemo |
Tlhaloso ea Sehlahisoa
Selelekela sa Merero ea PCBA
Khamphani ea ABIS CIRCUITS e fana ka lits'ebeletso, eseng lihlahisoa feela.Re fana ka tharollo, eseng feela thepa.
Ho tloha tlhahiso ea PCB, likarolo tse rekang ho ea ho likarolo lia bokana.E kenyeletsa:
- PCB Tloaelo
- Setšoantšo sa PCB / moralo ho latela setšoantšo sa hau sa moralo
- Tlhahiso ea PCB
- Ho fumana likarolo
- Khokahano ea PCB
- PCBA 100% teko
Melemo ea Rōna
- Mechini ea Pick and Place ea maemo a holimo e phahameng e ka sebetsanang le likarolo tse ka bang 25,000 tsa SMD ka hora.
- Bokhoni bo phahameng ba phepelo ea 60K Sqm khoeli le khoeli-E fana ka molumo o tlase le tlhahiso ea PCB e batloang, le lihlahisoa tse kholo.
- Sehlopha sa boenjiniere ba litsebi-40 baenjiniere le ntlo ea bona ea lisebelisoa, e matla ho OEM.E fana ka likhetho tse peli tse bonolo: Tsebo ea Tloaelo le e Tloaelehileng ka botebo ka IPC Class II le III Standards
Re fana ka ts'ebeletso e felletseng ea EMS ho bareki ba batlang hore re bokelle PCB ho PCBA, ho kenyeletsoa prototypes, morero oa NPI, molumo o monyane le o mahareng.Re boetse re khona ho fumana likarolo tsohle tsa morero oa hau oa kopano oa PCB.Baenjineri ba rona le sehlopha sa mehloli ba na le boiphihlelo bo bongata indastering ea phepelo le indastering ea EMS, ba nang le tsebo e tebileng kopanong ea SMT e lumellang ho rarolla mathata ohle a tlhahiso.Litšebeletso tsa rona li boloka chelete e ngata, lia tenyetseha ebile lia tšepahala.Re khotsofetse bareki ho pholletsa le liindasteri tse ngata ho kenyeletsa bongaka, indasteri, likoloi le lisebelisoa tsa motlakase tsa bareki.
Matla a PCBA
| 1 | Kopano ea SMT ho kenyelletsa kopano ea BGA |
| 2 | Li-chips tse amoheloang tsa SMD: 0204, BGA, QFP, QFN, TSOP |
| 3 | Bophahamo ba karolo: 0.2-25mm |
| 4 | Pakete e nyane: 0204 |
| 5 | Sebaka se fokolang har'a BGA : 0.25-2.0mm |
| 6 | Min BGA boholo: 0.1-0.63mm |
| 7 | Sebaka sa Min QFP: 0.35mm |
| 8 | Min kopano boholo: (X * Y): 50 * 30mm |
| 9 | Boholo ba kopano: (X * Y): 350 * 550mm |
| 10 | Ho nepahala ha ho khethoa: ± 0.01mm |
| 11 | Bokhoni ba ho beha: 0805, 0603, 0402 |
| 12 | Li-pin count e phahameng li fumaneha |
| 13 | Bokhoni ba SMT ka letsatsi: lintlha tse 80,000 |
Bokhoni - SMT
| Mela | 9(5 Yamaha,4KME) |
| Bokhoni | Ho beoa ha limilione tse 52 ka khoeli |
| Boholo ba Boto | 457*356mm.(18"X14") |
| Boholo ba Karolo e nyane | 0201-54 sq.mm.(0.084 sq.inch), sehokelo se selelele,CSP,BGA,QFP |
| Lebelo | 0.15 sec/chip,0.7 sec/QFP |
Bokhoni - PTH
| Mela | 2 |
| Bophara bo phahameng ba boto | 400 limilimithara |
| Mofuta | Maqhubu a mabeli |
| Boemo ba Pbs | Tšehetso ea mohala o sa lefelloeng |
| Mocheso o phahameng haholo | 399 likhato C |
| Fafatsa phallo | keketso |
| Ho chesa pele | 3 |
Taolo ea Boleng
| Teko ea AOI | E lekola li-solder pasteChecks bakeng sa likarolo ho fihla ho 0201 E hlahloba likarolo tse sieo, offset, likarolo tse fosahetseng, polarity |
| Tlhahlobo ea X-Ray | X-Ray e fana ka tlhahlobo ea qeto e phahameng ea: BGAs/Micro BGAs/Package ea Chip scale/Bare boards |
| Teko ea Potoloho | Teko ea In-Circuit hangata e sebelisoa mmoho le AOI e fokotsang mathata a tšebetso a bakoang ke mathata a likaroloana. |
| Teko ea Matla | Advanced Function TestFlash Device Programming Teko e sebetsang |
- IOC tlhahlobo e tlang
- SPI solder peista tlhahlobo
- Tlhahlobo ea AOI ea inthaneteng
- SMT tlhahlobo ea sengoloa sa pele
- Kelo ya ka ntle
- Tlhahlobo ea X-RAY-welding
- BGA sesebelisoa bocha
- QA tlhahlobo
- Anti-static warehousing le thomello
Setifikeiti
LBH
Che, re ke ke ra amohela lifaele tsa setšoantšo, haeba u se na faele ea gerber, na u ka re romella sampole ho e kopitsa.
Mokhoa oa ho kopitsa oa PCB&PCBA:
Sekhahla sa ho fana ka nako se feta 95%
a), Lihora tse 24 li fetoha ka potlako bakeng sa mohlala oa mahlakoreng a mabeli a PCB
b),48hours bakeng sa 4-8 le dikarolo mohlala PCB
c),1 hora bakeng sa qotso
d), Lihora tse 2 bakeng sa potso ea moenjiniere / maikutlo a tletlebo
e), lihora tsa 7-24 bakeng sa ts'ehetso ea tekheniki / tšebeletso ea taelo / ts'ebetso ea tlhahiso
PCB ke boto e nang le lipina le lipache tsa koporo tse hokahanyang likarolo tsa elektronike.PCBA e bolela ho bokana ha likarolo ho PCB ho theha sesebelisoa sa elektronike se sebetsang.
Speista ea khale e sebelisetsoa ho tšoara likarolo tsa elektronike ka nakoana pele li khomareloa ka ho sa feleng ho PCB nakong ea ts'ebetso ea reflow soldering.
| Bokhoni ba tlhahiso ea lihlahisoa tse rekisoang tse chesang | |
| Habeli Side/Multilayer PCB Workshop | Aluminium PCB Workshop |
| Bokhoni ba Tekheniki | Bokhoni ba Tekheniki |
| Lisebelisoa tse tala: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Lisebelisoa tse tala: Aluminium base, Copper base |
| Lera: 1 lera ho 20 Layers | Lera: 1 lera le 2 Layers |
| Min.line bophara/sebaka: 3mil/3mil(0.075mm/0.075mm) | Min.line bophara/sebaka: 4mil/4mil(0.1mm/0.1mm) |
| Min.Soba sa boholo: 0.1mm(sekoti sa dirilling) | Min.Boholo ba lesoba: 12mil(0.3mm) |
| Max.Boto ea boholo: 1200mm * 600mm | Boholo ba Boto: 1200mm* 560mm(47in* 22in) |
| Botenya ba boto bo felile: 0.2mm- 6.0mm | E felile botenya ba boto: 0.3 ~ 5mm |
| Botenya ba koporo ea foil: 18um ~ 280um (0.5oz ~ 8oz) | Botenya ba koporo ea foil: 35um ~ 210um (1oz ~ 6oz) |
| Mamello ea lesoba la NPTH: +/-0.075mm, Mamello ea lesoba la PTH: +/-0.05mm | Ho mamella boemo ba lesoba: +/-0.05mm |
| Mamello ea kemiso: +/-0.13mm | Mamello ea kemiso ea litsela: +/ 0.15mm;ho mamella kemiso ea ho otla: +/ 0.1mm |
| Bokaholimo bo felile: HASL e se nang lead, khauta e qoelisoang(ENIG), silevera e qoelisoang, OSP, ho penta ka khauta, monoana oa khauta, INK ea Carbon. | Bokaholimo bo felile: HASL ea mahala, khauta e qoelisoang (ENIG), silevera ea ho qoelisoa, OSP jj |
| Mamello ea taolo ea impedance: +/-10% | Lula ho mamella botenya: +/-0.1mm |
| Bokhoni ba tlhahiso: 50,000 sqm / khoeli | MC PCB Bokhoni ba tlhahiso: 10,000 sqm / khoeli |
Mekhoa ea rona ea ho netefatsa boleng joalo ka tlase:
a), Tlhahlobo ea Pono
b),Flying probe, fixture tool
c), Taolo ea impedance
d), Ho lemoha bokhoni ba Solder
e), microscope ea Digital metallogric
f), AOI(Tlhahlobo e Ikemetseng ea Optical)
Bili ea thepa (BOM) e hlalosang:
a),Mlintlha tsa likarolo tsa anufacturers,
b),CNomoro ea likarolo tsa bafani ba thepa (mohlala, Digi-key, Mouser, RS)
c), lifoto tsa mohlala oa PCBA ha ho khoneha.
d), Bongata
ABIS ha e na litlhoko tsa MOQ bakeng sa PCB kapa PCBA.
| Bokhoni ba tlhahiso ea lihlahisoa tse rekisoang tse chesang | |
| Habeli Side/Multilayer PCB Workshop | Aluminium PCB Workshop |
| Bokhoni ba Tekheniki | Bokhoni ba Tekheniki |
| Lisebelisoa tse tala: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Lisebelisoa tse tala: Aluminium base, Copper base |
| Lera: 1 lera ho 20 Layers | Lera: 1 lera le 2 Layers |
| Min.line bophara/sebaka: 3mil/3mil(0.075mm/0.075mm) | Min.line bophara/sebaka: 4mil/4mil(0.1mm/0.1mm) |
| Min.Soba sa boholo: 0.1mm(sekoti sa dirilling) | Min.Boholo ba lesoba: 12mil(0.3mm) |
| Max.Boto ea boholo: 1200mm * 600mm | Boholo ba Boto: 1200mm* 560mm(47in* 22in) |
| Botenya ba boto bo felile: 0.2mm- 6.0mm | E felile botenya ba boto: 0.3 ~ 5mm |
| Botenya ba koporo ea foil: 18um ~ 280um (0.5oz ~ 8oz) | Botenya ba koporo ea foil: 35um ~ 210um (1oz ~ 6oz) |
| Mamello ea lesoba la NPTH: +/-0.075mm, Mamello ea lesoba la PTH: +/-0.05mm | Ho mamella boemo ba lesoba: +/-0.05mm |
| Mamello ea kemiso: +/-0.13mm | Mamello ea kemiso ea litsela: +/ 0.15mm;ho mamella kemiso ea ho otla: +/ 0.1mm |
| Bokaholimo bo felile: HASL e se nang lead, khauta e qoelisoang(ENIG), silevera e qoelisoang, OSP, ho penta ka khauta, monoana oa khauta, INK ea Carbon. | Bokaholimo bo felile: HASL ea mahala, khauta e qoelisoang (ENIG), silevera ea ho qoelisoa, OSP jj |
| Mamello ea taolo ea impedance: +/-10% | Lula ho mamella botenya: +/-0.1mm |
| Bokhoni ba tlhahiso: 50,000 sqm / khoeli | MC PCB Bokhoni ba tlhahiso: 10,000 sqm / khoeli |
·Ka ABIS, bareki ba fokotsa litšenyehelo tsa bona tsa theko ea lefatše haholo le ka nepo.Ka morao ho ts'ebeletso e 'ngoe le e' ngoe e fanoang ke ABIS, ho patiloe ho boloka litšenyehelo bakeng sa bareki.
.Re na le mabenkele a mabeli 'moho, le leng ke la prototype, le rekoa kapele, le ho etsa molumo o monyane.E 'ngoe ke ea tlhahiso ea bongata hape bakeng sa boto ea HDI, e nang le basebetsi ba hloahloa ba hloahloa, bakeng sa lihlahisoa tsa boleng bo holimo tse nang le litheko tsa tlholisano le ho fana ka nako ka nako.
.Re fana ka thekiso e hloahloa haholo, tšehetso ea tekheniki le ea thepa, lefatšeng ka bophara ka lihora tse 24 tsa maikutlo a litletlebo.
