2 layers Custom PI Stiffeners Flexible Printed Circuit Boards PCBs
Lintlha tsa Motheo
| Mohlala No. | PCB-A42 |
| Sephutheloana sa lipalangoang | Ho paka ka Vacuum |
| Setifikeiti | UL,ISO9001&ISO14001,RoHS |
| Kopo | Lisebelisoa tsa elektronike tsa bareki |
| Bonyane Sebaka/Mola | 0.075mm/3mil |
| Bokhoni ba Tlhahiso | 720, 000 M2/Selemo |
| Khoutu ea HS | 853400900 |
| Tšimoloho | E entsoe chaena |
Tlhaloso ea Sehlahisoa
Flexible hatisitsoeng boto ea potoloho kakaretso
Tlhaloso
Flexible PCB - Flexible Printed Circuit, e bitsoang FPC.
Potoloho e hatisitsoeng e feto-fetohang e ka hlalosoa e le kemiso ea mesaletsa ea conductive e kopantsoeng le substrate e feto-fetohang.E entsoe ka lipaterone tsa li-conductor circuit ho sebelisa mokhoa o bobebe o pepesang phetiso le lits'ebetso tsa etching holim'a substrate e tenyetsehang.
Litšobotsi
Li-circuits tsa Flex tse sebelisoang haholo ho mehala ea cellular, lik'hamera le bohlaleaparoa.
E ka khona ho lekana hantle le bokhoni ba li-wiring libakeng ho feta liboto tse tloaelehileng tse thata.Mapolanka a potoloho a feto-fetohang a boetse a na le ho hanyetsa hamolemo mocheso o phahameng, ho tšoha le ho thothomela.e na le ts'ebetso e ntle e nang le liphephetso tsa moralo tse kang: li-crossovers tse ke keng tsa qojoa, litlhoko tse khethehileng tsa impedance, ho felisoa ha lipuo tsa sefapano, tšireletso e eketsehileng le bongata bo phahameng ba likarolo.
Hlophisa
PCB ea lehlakore le le leng la flex
Konokono ya lehlakore le le leng e nang le tse pediphihlello
flex PCB e mahlakoreng a mabeli
Multi-layer flex PCB
Setsebi le Bokhoni
| Ntho | Spec. |
| Mekhahlelo | 1~8 |
| Botenya ba Boto | 0.1mm-0.2mm |
| Substrate Material | PI(0.5mil,1mil,2mil),PET(0.5mil,1mil) |
| Conductive Medium | Foil ea koporo(1/3oz,1/2oz,1oz,2oz) Constantan Peista ea Silver Enke ea Koporo |
| Boholo ba Panel | 600mmx1200mm |
| Min Hole Size | 0.1 limilimithara |
| Min Line Width/Space | 3mil(0.075mm) |
| Boholo ba boholo ba ho kenngoa (phanele e le 'ngoe le habeli) | 610mm*1200mm(Moeli oa ho pepeseha) 250mm * 35mm (feela ntshetsa pele disampole teko) |
| Boholo bo boholo ba ho beoa (phanele e le 'ngoe & phanele e habeli ha ho na enke ea ho omisa ea PTH + e tiileng ea khanya ea UV) | 610*1650mm |
| Hole Hole (Mechanical) | 17um--175um |
| Qetella Hole (Mechanical) | 0.10mm--6.30mm |
| Mamello ea Diameter (Mechanical) | 0.05 limilimithara |
| Ngoliso (Mochini) | 0.075 limilimithara |
| Aspect ratio | 2:1(Bonyane monyetla oa ho bula 0.1mm) 5:1(Bonyane abula ke 0.2mm) 8:1(Bonyane monyetla oa ho bula 0.3mm) |
| SMT Mini.Solder Mask Width | 0.075 limilimithara |
| Mini.Solder Mask Clearance | 0.05 limilimithara |
| Mamello ea Taolo ea Impedans | 10% |
| Qetello ea bokaholimo | ENIG, HASL, Chem.Tin/Sn |
| Mask ea solder / Filimi e Sireletsang | PI(0.5mil,1mil,2mil)(Yellow, White, Black) PET(1mil,2mil) Mask ea solder (e tala, e mosehla, e ntšo ...) |
| Silkscreen | Bokhubelu/Bosehla/Botsho/Bosweu |
| Setifikeiti | UL, ISO 9001, ISO14001, IATF16949 |
| Kopo e khethehileng | Sekhomaretsi(3M467,3M468,3M9077,TESA8853...) |
| Bafani ba Lintho | Shengyi, ITEQ, Taiyo, joalo-joalo. |
| Sephutheloana se Tloaelehileng | Vacuum+Carton |
| Bokhoni ba tlhahiso ea khoeli le khoeli/m² | 60,000 m² |
Flexible PCB Keta Nako
| Sehlopha se senyenyaneBolumo ≤1 sq mithara | Matsatsi a Tshebetso | Tlhahiso ea 'Misa | Matsatsi a Tshebetso |
| E Mahlakore a le Mong | 3-4 | E Mahlakore a le Mong | 8-10 |
| Likarolo tse 2-4 | 4-5 | Likarolo tse 2-4 | 10-12 |
| 6-8 mekhahlelo | 10-12 | 6-8 mekhahlelo | 14-18 |
ABIS e sebetsana joang le Mathata a Flexible PCB?
Ntho ea pele eo re e netefatsang ke lisebelisoa tse nepahetseng ho hlahisa boto ea hau.Ka mor'a moo, basebetsi ba ile ba ba le phihlelo e lekaneng ea ho sebetsana le phephetso ea ho etsa liboto tse tenyetsehang.
Ho bula mask a solder kapa ho koahela mehato e lekaneng-e fapaneng ea ts'ebetso ho ka fetola tsela eo boto e tenyetsehang e shebahalang ka eona.Etching le plating li ka fetola sebopeho sa PCB, ke ka lebaka leo u lokelang ho etsa bonnete ba hore menyetla e holimo ke ea bophara bo loketseng.
Khetha thepa ka hloko, hape u nahane ka lintho tse ling, tse kang boholo, boima, le botšepehi ba boto.
Laola sebaka se loketseng sa manonyeletso a solder le ntlha ea ho kobeha - motsoako oa solder o lokela ho ba sebaka se hlokahalang ho tloha moo ho kobehang.Haeba u li beha haufi haholo, delamination kapa solder pad e ka 'na ea etsahala.
Control Solder pad spacing - ABIS etsa bonnete ba hore ho na le sebaka se lekaneng pakeng tsa mekatelo le mesaletsa conductive haufi le bona, e le hore ho qoba lamination tahlehelo.
ABIS Quality Mission
Sekhahla sa ho feta sa thepa e kenang ka holimo ho 99.9%, palo ea litekanyetso tsa ho hana ka bongata ka tlase ho 0.01%.
Mehaho e netefalitsoeng ea ABIS e laola lits'ebetso tsohle tsa bohlokoa ho felisa litaba tsohle tse ka bang teng pele li hlahisoa.
ABIS e sebelisa software e tsoetseng pele ho etsa tlhahlobo e batsi ea DFM mabapi le data e kenang, 'me e sebelisa mekhoa e tsoetseng pele ea taolo ea boleng ho pholletsa le ts'ebetso ea tlhahiso.
ABIS e etsa tlhahlobo ea 100% ea pono le ea AOI hammoho le ho etsa tlhahlobo ea motlakase, tlhahlobo ea matla a phahameng a motlakase, tlhahlobo ea taolo ea impedance, likaroloana tse nyane, tlhahlobo ea mocheso oa mocheso, tlhahlobo ea solder, tlhahlobo ea ho tšepahala, tlhahlobo ea insulate resistance le tlhahlobo ea bohloeki ba ionic.
Setifikeiti
LBH
Moreki e mong le e mong o tla ba le thekiso ea ho ikopanya le uena.Lihora tsa rona tsa ho sebetsa: AM 9:00-PM 19:00 (Nako ea Beijing) ho tloha Mantaha ho fihlela Labohlano.Re tla araba lengolo-tsoibila la hau kapele ka nako ea rona ea ho sebetsa.Hape o ka ikopanya le thekiso ea rona ka mohala oa mohala haeba ho potlakile.
Mekhoa ea rona ea ho netefatsa boleng ka tlase:
a), Tlhahlobo ea Pono
b), Sesebelisoa se fofang, sesebelisoa sa ho lokisa
c), Taolo ea tšitiso
d), ho lemoha bokhoni ba ho rekisa
e), microscope ea Digital metallog
f), AOI (Automated Optical Inspection)
Ka kakaretso matsatsi a 2-3 bakeng sa ho etsa sampole.Nako ea ho etella pele ea tlhahiso ea bongata e tla itšetleha ka bongata ba taelo le nako eo u behang taelo ka eona.
Mekhoa ea rona ea ho netefatsa boleng ka tlase:
a), Tlhahlobo ea Pono
b), Sesebelisoa se fofang, sesebelisoa sa ho lokisa
c), Taolo ea tšitiso
d), ho lemoha bokhoni ba ho rekisa
e), microscope ea Digital metallog
f), AOI (Automated Optical Inspection)
ABIS ha e na litlhoko tsa MOQ bakeng sa PCB kapa PCBA.
ABlS e etsa tlhahlobo ea pono ea 100% le AOl hammoho le ho etsa liteko tsa motlakase, tlhahlobo ea motlakase o phahameng,taolo ea impedancetlhahlobo, likaroloana tse nyane, tlhahlobo ea mocheso oa mocheso, tlhahlobo ea solder, tlhahlobo ea ho ts'epahala, tlhahlobo ea insulating, tlhahlobo ea bohloeki ba ionicle tlhahlobo ea ts'ebetso ea PCBA.
Ka kopo, romella tlhahlobo ea lintlha ho rona, joalo ka Nomoro ea Ntho, Bongata ba ntho ka 'ngoe, Kopo ea Boleng, Letšoao, Melao ea Tefo, Mokhoa oa Lipalangoang, Sebaka sa Ts'ebetso, joalo-joalo. Re tla u etsetsa quotation e nepahetseng kapele kamoo ho ka khonehang.
Sekhahla sa ho fana ka nako se feta 95%
a), Lihora tse 24 li fetoha ka potlako bakeng sa mohlala oa mahlakoreng a mabeli a PCB
b), lihora tse 48 bakeng sa likarolo tse 4-8 tsa mohlala oa PCB
c), hora e 1 bakeng sa qotso
d), lihora tse 2 bakeng sa potso ea moenjiniere / maikutlo a tletlebo
e), lihora tse 7-24 bakeng sa ts'ehetso ea tekheniki / tšebeletso ea taelo / ts'ebetso ea tlhahiso
| Bokhoni ba tlhahiso ea lihlahisoa tse rekisoang tse chesang | |
| Habeli Side/Multilayer PCB Workshop | Aluminium PCB Workshop |
| Bokhoni ba Tekheniki | Bokhoni ba Tekheniki |
| Lisebelisoa tse tala: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Lisebelisoa tse tala: Aluminium base, Copper base |
| Lera: 1 lera ho 20 Layers | Lera: 1 lera le 2 Layers |
| Min.line bophara/sebaka: 3mil/3mil(0.075mm/0.075mm) | Min.line bophara/sebaka: 4mil/4mil(0.1mm/0.1mm) |
| Min.Soba sa boholo: 0.1mm(sekoti sa dirilling) | Min.Boholo ba lesoba: 12mil(0.3mm) |
| Max.Boto ea boholo: 1200mm * 600mm | Boholo ba Boto: 1200mm* 560mm(47in* 22in) |
| Botenya ba boto bo felile: 0.2mm- 6.0mm | E felile botenya ba boto: 0.3 ~ 5mm |
| Botenya ba koporo ea foil: 18um ~ 280um (0.5oz ~ 8oz) | Botenya ba koporo ea foil: 35um ~ 210um (1oz ~ 6oz) |
| Mamello ea lesoba la NPTH: +/-0.075mm, Mamello ea lesoba la PTH: +/-0.05mm | Ho mamella boemo ba lesoba: +/-0.05mm |
| Mamello ea kemiso: +/-0.13mm | Mamello ea kemiso ea litsela: +/ 0.15mm;ho mamella kemiso ea ho otla: +/ 0.1mm |
| Bokaholimo bo felile: HASL e se nang lead, khauta e qoelisoang(ENIG), silevera e qoelisoang, OSP, ho penta ka khauta, monoana oa khauta, INK ea Carbon. | Bokaholimo bo felile: HASL ea mahala, khauta e qoelisoang (ENIG), silevera ea ho qoelisoa, OSP jj |
| Mamello ea taolo ea impedance: +/-10% | Lula ho mamella botenya: +/-0.1mm |
| Bokhoni ba tlhahiso: 50,000 sqm / khoeli | MC PCB Bokhoni ba tlhahiso: 10,000 sqm / khoeli |
